More in Webcasts

  • Jan 22, 2015
    webinar

    PCB Materials, Simulations, and Measurements for 32 Gb/s

    Breaking the 32 Gb/s barrier for printed circuit board (PCB) channels requires a strong understanding of PCB stack-up design, simulation methods, and measurement techniques. How a PCB fabrication document calls out the materials, such as fiber weave and surface roughness, is critical to high speed performance....More
  • Nov 19, 2014
    webinar

    High Speed Interconnects, Signal Integrity, S-parameters and how to accurately characterize your Device

    Signal integrity through connectors, interconnects, transmitters and receivers affect product reliability and system performance and has become a major challenge for designers of high speed systems. During this hour we will review signal integrity from several angles....More
  • Dec 10, 2014
    webinar

    Optimizing 100G Ethernet Electrical Measurements

    Characterizing signal and multi-lane 100G Ethernet digital links can be daunting and time consuming, driven by a wide range of test parameters and conditions. After carefully setting up the device, clock recovery, error detection, and test parameters, the user is still faced with understanding standards documents like IEEE 802.3-2012/bj/bm, and interpreting the results....More
  • Nov 18, 2014
    webinar

    Switch Mode Power Supply Measurements and Analysis using Oscilloscopes

    Learn how to gain greater insight into the performance and efficiency of switch mode power supplies using oscilloscopes....More
  • Nov 12, 2014
    webinar

    Ten Oscilloscope Innovations You’ll Want that Didn’t Exist Three Years Ago

    Human interface design of modern electronics have dramatically improved to increase productivity. In parallel, oscilloscope user interfaces have had radical improvements to speed debug and analysis....More
  • Oct 23, 2014
    webinar

    PAM-4 Solutions for Transmit and Receive Design Characterization

    400 Gb/s links will be the next step in the continuing need for increased network bandwidth in data centers. Multi-level signaling formats such as PAM-4 are an enabling technology to implement 400G....More
  • Oct 21, 2014
    webinar

    MIPI M-PHY, D-PHY and C-PHY Receiver Testing - Today and Tomorrow

    The mobile industry benefits from standards for hardware and software interfaces for mobile devices established by the MIPI Alliance. Data rate extensions of existing D-PHY and M-PHY interfaces, as well as the recently published multiple bit/symbol C-PHY interface, meet demands for higher aggregate bandwidth....More
  • Oct 30, 2014
    webinar

    SuperSpeed USB 10Gbps (USB 3.1) Physical Layer Test Challenges

    Driven by the demand for more bandwidth, high speed digital standards continues to evolve to higher data rates. The USB 3.1 specification delivers more than double the practical data rate compared to the current 5 Gbps USB 3.0, by implementing a more efficient data encoding scheme. This results in even tougher requirements for the physical layer to ensure interoperability at 10 Gbps....More
  • Nov 6, 2014
    webinar

    How to Achieve Compliance to the New 1E-16 BER Contour Spec in DDR4

    For the first time in a DDR standard, JEDEC has included in a BER contour spec for DDR4. The eye opening of the 1E-16 BER contour of DQ lines must not violate the mask. This specification presents new simulation and measurement challenges....More
  • Oct 29, 2014
    webinar

    Measuring Power Rail Signal Integrity with Oscilloscopes

    Power rails play a critical part in today’s electronic device development. The need to see and characterize small disturbances on rails is increasing as are the challenges to make these measurements. Attend the webinar and learn what scope attributes—from the acquisition engine to the probe tip—enable more precise and comprehensive testing of power rails....More
  • Jun 18, 2014
    webinar

    GaN Roundtable: Keeping It Cool With GaN Thermal Management

    Gallium Nitride (GaN) based technologies are experiencing a wide adoption throughout the high-frequency and high-power RF/Microwave industries. As higher frequency and higher power signals are passed through devices, heat becomes an intrinsic limiting factor that also raises costs. There are many creative solutions for decreasing the thermal stresses on GaN semiconductors....More
  • Apr 8, 2014
    webinar

    Tips for Successfully Integrating and Passing WLAN Regulatory Tests

    Live Webinar: April 8, 2014 at 2 p.m. ET / 11 a.m. PT | If you’re integrating a WLAN radio into your design, you probably have questions on how to pass compliance tests for FCC regulations. Surprisingly, only 1 in 10 engineers pass the first time. And failing is expensive and translates to project delays....More
  • Apr 2, 2014
    webinar

    MIPI Physical Layer Transmitter Test Solutions

    Live Webinar: April 2, 2014 at 1 p.m. ET / 10 a.m. PT | New physical standards are being developed by Mobile Industry Processor Interface (MIPI) Alliance standards body, which standardizes interfaces for mobile applications and designs. Additional capabilities and data rate extensions will be added to the existing D-PHY and M-PHY specifications to push the performance envelope. A new C-PHY specification will also be created, which is based on a new 3-wire multi-level signaling scheme to achieve higher performance through higher bits/symbol. If you are developing or validating the transmitters of these new MIPI physical layers, you'll want to attend this webcast to understand the new test challenges as well as the solutions....More
  • Mar 27, 2014
    webinar

    Simulation-Measurement Workflow for DDR Compliance

    Live Webinar: March 27, 2014 at 1 p.m. ET / 10 a.m. PT | This webcast discusses Agilent DDR3 and DDR4 compliance test applications using both pre-silicon simulated waveforms and post-silicon measured waveforms, with emphasis on correlating simulation with measurement. We will describe a methodology for simulating the full path from memory controller to DRAM solder ball. A simulation-measurement correlation methodology called “Waveform Bridge” is discussed where DQ and DQS waveforms in both pre-layout and post-layout simulations are used to feed a DDR compliance test app....More
  • Mar 12, 2014
    webinar

    Do You Have What it Takes to Test HDMI 2.0?

    Live Webinar: March 12, 2014 at 1 p.m. ET/10am PT | In this webcast, we will provide an HDMI 2.0 technical overview as well as cover the latest physical layer testing requirements for HDMI 2.0 as well as the previous specification (HDMI 1.4b). Join us to learn about the new testing requirements and what it takes to stay ahead of HDMI physical layer testing challenges....More
  • Feb 27, 2014
    webinar

    Endless Application Possibilities with Near Field Communication (NFC)

    Live Webinar: February 27, 2014 at 10 a.m. ET/ 7 a.m. PT | Gone are the days of setting up wireless connectivity manually. Near Field Communication (NFC) technology is taking off, and the proliferation of smart phones, tablets and notebooks is driving the integration of NFC into many other end products and devices. These applications include contactless, mobile payments; Bluetooth / Wi-Fi device pairing; and advanced sensor transponders which communicate through NFC....More
  • Feb 19, 2014
    webinar

    SFP+ and 10GBASE-KR Transmitter Compliance Using Real-time and Sampling Oscilloscopes

    As cloud computing and data centers expand more and more network hardware will need to be interconnected through fiber and backplane connections. The SFF-8431 and IEEE 802.3ap specifications keep these technologies humming through tight tolerances that are required from all SFP+ and 10GBASE-KR applications....More
  • Jan 23, 2014
    webinar

    Fixture De-embedding Techniques for 28 Gb/s Transmitter Measurements

    Live Webinar: January 23, 2014 at 1 p.m. ET/10am PT | Gone are the days when IC pins were accessible and when bit rates were low enough that the probe loading was negligible. Today’s high density BGA packages and multi-gigabit/s data rates present twin challenges to signal integrity engineers who want to measure the eye diagram at the IC solder bump....More
  • Jan 9, 2014
    webinar

    The Fundamentals of Fast Pulsed IV Measurement

    Live Webinar: January 9, 2014 at 1 p.m. ET | In this webcast Agilent Technologies will cover all of the basics of fast pulsed IV measurement including: • An overview of pulsed measurement solution options • The pros and cons of DC probes versus RF probes for on-wafer measurement • Proper structure design practices to optimize on-wafer measurements • General tips and tricks to improve high-speed measurement results • Examples of high-speed IV measurement applications (NBTI/PBTI, RTS noise, etc....More
  • Dec 17, 2013
    webinar

    GaN Roundtable: Doherty Amplifiers and GaN Device Technology

    Featuring presenters from some of the leading GaN manufacturers in the microwave industry, this webcast roundtable will provide the latest information on GaN power transistors and ICs and how they are driving Doherty-amplifier performance for wireless communications and many other applications. Learn about the state of the art in today’s Doherty amplifiers and the GaN devices that are making these enhanced performance levels possible. This roundtable also will give you a chance to find out what lies ahead for both Doherty amplifiers and GaN device technology....More
  • Dec 17, 2013
    webinar

    Using Logic Analysis to Find Root Cause of Digital Design Errors

    This Webcast will explore how the root-cause of functional and timing errors can be easily found by using a logic analyzer early in the debug process. Learn how to observe bus-level signal integrity to get a quick overview of possible design violations involving wide parallel buses. Different techniques will be shown to help you accelerate your digital system debug and validation process....More
  • Dec 4, 2013
    webinar

    Extreme Oscilloscope Probing: Extreme Challenges Call for Extreme Solutions

    The demands placed on today's electronic products tend to far exceed what was expected from electronics just a few years ago. Mobile products are expected to operate and survive a wide range of environmental conditions all the while preserving battery life. Similarly, automotive or industrial applications are expected to function reliably over a wide range of potential harsh conditions....More
  • Nov 5, 2013
    webinar

    True Differential S-Parameter Measurements

    Differential structures such as backplanes and cables are the primary means for transmitting high speed serial data signals. Signal integrity of these systems is determined by the characteristics of the media such as insertion loss, crosstalk, and differential to common mode conversion....More
  • Oct 9, 2013
    webinar

    Webcast: Phase Noise & Jitter Measurements

    This session will cover the theory and practice for making phase noise measurements on clock signals as well as the relationship between phase noise and total jitter, random jitter and deterministic jitter. Measurements on a typical clock signal will be presented....More
  • Oct 29, 2013
    webinar

    Fundamentals of Semiconductor Capacitance Measurement

    Capacitance measurement is an essential part of semiconductor device characterization. However, capacitance measurement is one area of parametric test where many easily preventable measurement mistakes are often made. The main reason for this is a scarcity of training material on fundamental capacitance measurement theory and on how to make proper capacitance measurements....More
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Webcasts

Power Integrity Measurements – Choosing the Right Tools
February 26, 2015 @ 1pm EST
Sponsored by Keysight Technologies
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USB 3.1 - Gen2 10Gbps Receiver Test Challenges
March 11, 2015 @ 1pm EST
Sponsored by Keysight Technologies
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