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John Coonrod

Articles by John Coonrod
Navigating Multilayer Microwave PCB Tradeoffs 1
There are numerous ways to assemble multilayer microwave printed circuits, depending on whether cost or performance is important, and when factors such as ease of fabrication and reliability are critical.
Thermal Design Begins At The Circuit Board 1
Understanding different characterization parameters related to temperature can help when selecting a printed-circuit-board material for high-power RF/microwave applications.
Microwave Materials Lay Foundation For PAs
Understanding key material parameters can help power-amplifier designers to choose the optimum high-frequency laminate in support of their circuits.

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