Staff

Staff
Articles
Agile Signal Generator Delivers Reliable Switching in Complex Simulations
Keysight’s latest UXG agile signal generator can switch frequency, amplitude, and phase settings in as little as 250 ns, creating realistic multi-threat simulations.
High-Gain GaN-on-SiC Transistors Eye Radar Pulsed Apps
MACOM’s gallium-nitride (GaN)-on-silicon carbide (SiC) HEMT pulsed-power transistors operate over multiple octave bandwidths.
Keysight Hosts Design & Testing Workshops, Demos
Keysight Technologies demonstrated a variety of test solutions alongside workshops, with focus on everything from warfare testing to 5G communication.
12G-SDI Chipset Enables 4K Monitoring
PHABRIX will incorporate MACOM’s 12G-SDI chipset in its 4K monitoring instruments.
EU Joining Forces with South Korea on 5G
The European Union is forming a joint research partnership with South Korea to focus on ultrafast 5G mobile broadband technology.
Successful Small Diameter Bomb II Tests Augur Production Phase
Upgraded electronics for the SDB II center around Raytheon’s tri-mode seeker, which fuses millimeter-wave radar, uncooled infrared imaging, and digital semi-active laser sensors on a single gimbal.
Converter Simplifies Replacement Of Obsolete ANSI x3.28 Controllers
Up to now, swapping out obsolete controllers that use the ANSI x3.28 protocol has proven impractical because production systems would require modification to work with a modern Modbus RTU-compatible controller.
Coaxial Contacts Bring RF To VPX Platforms
SV Microwave says its latest floating SMPM coaxial contacts ensure excellent RF performance in any VPX platform mating condition.
Plans Detailed for Domestic Comsat
“Pilot” satellite would carry 24 transponders. Up to 36 ground antennas involved.
Microwaves & RF reports from IMS 2012
IMS 2012, Day 3: A Sea of Semiconductor Vendors Plumbing as a metaphor for microwaves Lou Frenzel summarizes some of what he saw and heard from the many semiconductor vendors that were represented at this year's event. June 21, ...
2010 Editorial Index
COMMERCIAL An Interview With Jim McGillivary (Jan., p. 22) An Interview With John Regazzi (Feb., p. 42) Wireless Demands Focus Designers On Integration (Feb., p. 34) An Interview With Dr. Lawrence Williams (March, p. 42) An Interview ...
International Microwave Symposium 2010
Videos from IMS 2010 The IEEE's 2010 International Microwave Symposium (IMS) was packed with people, new products, and cutting-edge technology. Microwaves & RF covered the show from all angles, to give design engineers a roadmap for the week's most ...
Sizing Up Benefits Of Wafer-Scale Packaging
Wafer-scale packaging (WSP) is a bold new approach to housing semiconductors. It uses a semiconductor process to create a package around an ICa package that is only slightly larger than the chip itself. It can be used with both silicon and GaAs ICs to ...
Avago RF VMMK Devices Improve Performance by Reducing Parasitic Inductance and Capacitance
Packaging has always significantly impacted on microwave IC and amplifier performance. In most cases, the inherent parasitic capacitance and inductance of the package lead frame and wire bonds set a limit to circuit performance. Avago Technologies ...
White Paper: Fiber Optic Transceivers in Basestation Applications
Base station transceivers with greater bandwidth are in demand. Fiber optic links give cost effective, high bandwidth new capacity with more flexibility than copper links. Fiber links make system modifications and future upgrades simpler than would be ...
Whitepapers

Adding EMI Pre-compliance Testing to the Product Development Process is Cost-effective Insurance
Sponsored by Keysight Technologies
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New! Wi-Fi Standards Poster
Sponsored by Tektronix
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Reducing Life Cycle Costs with Reliable Airframe Microwave Assemblies
Sponsored by WL Gore
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Power Integrity Measurements – Choosing the Right Tools
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USB 3.1 - Gen2 10Gbps Receiver Test Challenges
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