Packaging can be challenging for both RF and direct-current (DC) power circuits. For circuits ranging from chip-scale devices to power modules, however, a new packaging option is now available from Remtec. The company has merged the thermally and electrically conductive Power Transfer Vias (PTVs) with its core Plated Copper on Thick Film (PCTF) metallization technology.
An imaging system based on transmission and reflection modes in the terahertz region has been developed by using a backward-wave oscillator (BWO) as its source, a Golay-Cell as the detector, and an oscilloscope as a data acquisition unit.
Thanks to spatial power combining, these solid state power amplifiers (SSPAs) do not limit the amount of power that could be provided by an individual solid-state transistor—a problem that is often encountered when SSPAs are used in broadcast satellite-uplink terminals.
A test by the Missile Defense Agency demonstrated the interoperability of three regional missile defense systems: the Aegis Ballistic Missile Defense System, Patriot Advanced Capability-3 (PAC-3) Missile, and Terminal High-Altitude Area Defense (THAAD) weapon system.
GaN Roundtable: The State of GaN Reliability Today
Wednesday, April 3rd, 2013, 2:00 pm ET. Gallium nitride (GaN) has come a long way over the past few years in terms of affordability, industry acceptance and, in particular, reliability. In this webcast roundtable, a panel of expert speakers will assess the current state of GaN reliability, along with offering predictions for its future.
New App Note: Best Practices for Making the Most Accurate Radar Pulse Measurements Sponsored by Agilent Technologies Download this app note
Agilent Technologies Complex Modulation Generation with Low Cost Arbitrary Waveform Generators - Agilent's Trueform Architecture for Wireless Applications
Sponsored by Agilent Technologies Download this white paper