Via Technology Packages Power Modules
Packaging can be challenging for both RF and direct-current (DC) power circuits. For circuits ranging from chip-scale devices to power modules, however, a new packaging option is now available from Remtec. The company has merged the thermally and electrically conductive Power Transfer Vias (PTVs) with its core Plated Copper on Thick Film (PCTF) metallization technology.
UE Testing Eases Transition To VoLTE
As developers strive to ensure interoperability between legacy 3GPP or non-3GPP technologies and LTE, it will be critical to accurately and efficiently voice-test LTE user equipment.
Terahertz Imaging System Uses BWO As Source
An imaging system based on transmission and reflection modes in the terahertz region has been developed by using a backward-wave oscillator (BWO) as its source, a Golay-Cell as the detector, and an oscilloscope as a data acquisition unit.
WiGig And VESA Form Working Group
A working group is now taking strides to make sure that future WiGig devices are compatible with DisplayPort, which is one of the most widely established display connection technologies for PCs.
Use SSC Oscillators To Banish EMI
Because electromagnetic interference (EMI) stems from system clocks, it can be most efficiently and economically reduced with the use of spread spectrum clock (SSC) oscillators.
600-W, C-Band GaAs SSPA Rivals TWTAs
Thanks to spatial power combining, these solid state power amplifiers (SSPAs) do not limit the amount of power that could be provided by an individual solid-state transistor—a problem that is often encountered when SSPAs are used in broadcast satellite-uplink terminals.
RFID Stent Tag Senses Vessel’s State
With the ability to monitor processes as they evolve, radio frequency identification (RFID) can benefit telemedicine and health-monitoring devices.
Three-Pronged Missile-Defense Test Engages Multiple Targets
A test by the Missile Defense Agency demonstrated the interoperability of three regional missile defense systems: the Aegis Ballistic Missile Defense System, Patriot Advanced Capability-3 (PAC-3) Missile, and Terminal High-Altitude Area Defense (THAAD) weapon system.
