A new Xinger has been added to Anaren's (East Syracuse, NY) comprehensive line of compact signal-processing components. The new 3-dB hybrid coupler operates from 800 to 1000 MHz and is designed for close matching of the coefficient of thermal expansion (CTE) to the most popular high-frequency substrate materials, including FR4, G-10, and laminates from Rogers Corp. and Taconics. The coupler, which measures 9 x 7 x 2.8 mm, features maximum insertion loss of 0.3 dB and minimum isolation between ports of 20 dB. In spite of its small size, it is rated to handle input power levels to 115 W. The company's wireless product line manager, Hans Peter Ostergaard, notes that "this component is well suited for AMPS and GSM900 applications, and it's even smaller than our traditional Xinger-brnad 800-1000 MHz part, so OEMs can save even more board space."

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