Ceramic substrate and package supplier Remtec recently marked 20 years in the industry, serving both commercial and military customers. The firm, known for its plated copper on thick film (PCTF) packaging technology, was founded in 1990 and issued a patent for its PCTF technology in 1994. According to Remtec President Nahum Rapoport, "Over these years, we have focused on design, development and manufacture of reliable, cost-effective products providing a multitude of ceramic packaging solutions that meet the changing and demanding needs in DC power electronics, RF/microwave packaging and optoelectronics."
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Ceramic Specialist Celebrates 20 Years
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GaN Roundtable: The State of GaN Reliability Today
Wednesday, April 3rd, 2013, 2:00 pm ET. Gallium nitride (GaN) has come a long way over the past few years in terms of affordability, industry acceptance and, in particular, reliability. In this webcast roundtable, a panel of expert speakers will assess the current state of GaN reliability, along with offering predictions for its future.
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Agilent Technologies Complex Modulation Generation with Low Cost Arbitrary Waveform Generators - Agilent's Trueform Architecture for Wireless Applications
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