The MicroLine 1000S laser system from LPKF provides a cost-effective method for ultraviolet-laser depaneling of assembled printed-circuit boards (PCBs). The UV laser system processes substrates as large as 250 x 350 mm using a 5-W laser beam that is 20 microns in diameter. The laser operates at a wavelength of 355 nm. It can cut substrates close to delicate components without causing stress, allowing high assembly densities to be realized. According to Dr. Ingo Bretthauer, Chairman of the LPKF Board of Directors, "The MicroLine 1000 S combines a low entry-level price with the highest cutting quality and superior process capabilities. At the same time it is especially flexible and therefore suited for high manufacturing variance." This tool-less method of processing electronic substrates makes it possible to create almost any type of contour without thermal or mechanical stress.