Automated packaging specialist Palomar Technologies will be sharing some secrets at the upcoming SEMICON West show (July 15-17) next week. In addition to showing its systems and processes for automatic packaging of optical and microelectronic devices and components, the firm's Senior Scientist, Dan Evans, and Systems Engineer, Albert Perez, will be presenting "Chain Wire Bonding of a RF-SOE Package Using a Gold Ball Bonder" the day before SEMICON West at the IMAPS/SEMI Advanced Technology Workshop.

Palomar is a major supplier of automated high-precision wire bonders and component placement systems along with process development and contract assembly services to increase yield and lower costs for manufacturers.