The Advanced Circuit Materials Division (ACMD) and its newly formed Thermal Management Solutions (TMS) Division of Rogers Corp. will be exhibiting RO4000, RO2808, and ULTRALAM 3000 high-frequency laminates and HEATWAVE and COOLSPAN thermal management materials at the upcoming DesignCon 2009 show, scheduled for Feb. 3-4, 2009 at the Santa Clara Convention Center (Santa Clara, CA). The laminates are well suited for high-performance analog and data-transmission application in computer, telecommunications, and wireless communications applications while the thermal management solutions are ideal for controlling heat in semiconductor packaging and power amplifiers.
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Rogers Airs Laminates, Thermal Materials At DesignCon 2009
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