Packaging innovator StratEdge will be displaying its lines of high-performance, high-power packages for applications past 50 GHz at booth 2021 at the 2010 IMS. The rugged packages meet MIL-STD 883 and MIL-PRF 38534 testing standards for use in high-reliability military and space applications. The firm's newest developments are in its Surface Mount and Power Package families of products. For example, Power Package products feature high-thermal-conductivity bases that can better dissipate the heat produced by high-power devices, such as gallium nitride (GaN) transistor chips.

According to StratEdge President, Tim Going, "High-power devices are smaller and hotter than previous devices and it is difficult to find a good package match in the marketplace. That's why we continue to concentrate on developing and testing materials for new packages." StratEdge will also highlight its microelectronic assembly services and turnkey package solutions at IMS 2010.