A new line of direct bond substrates based on Curamik DBC direct-bond-ceramic (DBC) materials from Remtec, Inc. supports a wide range of power applications. By combining the DBC and plated copper on thick film (PCTF) technologies, circuit and package designers have a proven material for highly reliable designs. Available in a range of copper thicknesses from 0.0005 to 0.012 in. copper thickness, the substrates are supplied in nominal copper thicknesses of 0.005, 0.008, and 0.012 in. on 5.0 x 7.0 alumina and aluminum nitride cards.
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Substrates Support Power Packages
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Webcasts
GaN Roundtable: The State of GaN Reliability Today
Wednesday, April 3rd, 2013, 2:00 pm ET. Gallium nitride (GaN) has come a long way over the past few years in terms of affordability, industry acceptance and, in particular, reliability. In this webcast roundtable, a panel of expert speakers will assess the current state of GaN reliability, along with offering predictions for its future.
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Whitepapers
New App Note: Best Practices for Making the Most Accurate Radar Pulse Measurements
Sponsored by Agilent Technologies
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Agilent Technologies Complex Modulation Generation with Low Cost Arbitrary Waveform Generators - Agilent's Trueform Architecture for Wireless Applications
Sponsored by Agilent Technologies
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