A measurement solution developed jointly by Agilent Technologies and picoChip aims at high-volume testing of devices for third-generation (3G) cellular femtocell products. It incorporates Agilent's N7310A chipset control software and picoChip's picoXcell semiconductors and software. Agilent's software works with the firm's MXA, EXA, MXG and ESG analyzers and signal generators. picoChip's PC6201 manufacturing bundle includes a SCPI-based manufacturing interface, controlling test PHY and a radio application-programming interface. According to David Maidment, Vice President of Product Management for picoChip, "Bringing a consumer market approach to the network infrastructure business is not an easy transition. This new manufacturing test solution is a key part of our ability to provide the proven, fully tested solutions that the market requires."
Tester Checks Femtocell Chips
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GaN Roundtable: The State of GaN Reliability Today
Wednesday, April 3rd, 2013, 2:00 pm ET. Gallium nitride (GaN) has come a long way over the past few years in terms of affordability, industry acceptance and, in particular, reliability. In this webcast roundtable, a panel of expert speakers will assess the current state of GaN reliability, along with offering predictions for its future.
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