Tiny Chip Baluns Cut Insertion Loss To 0.6 dB

April 12, 2007
Multilayer chip baluns have emerged to tackle the impedance matching between equilibrium/nonequilibrium circuits in RF circuits for WiMAX communications equipment. At 1.6 X 0.8 X 0.6 mm, these multilayer baluns boast an insertion loss of 0.6 dB ...

Multilayer chip baluns have emerged to tackle the impedance matching between equilibrium/nonequilibrium circuits in RF circuits for WiMAX communications equipment. At 1.6 X 0.8 X 0.6 mm, these multilayer baluns boast an insertion loss of 0.6 dB and bestin-class frequencies of 2.5 and 3.6 GHz. To achieve low insertion loss in a 1608 size, the baluns leverage low-temperature firing materials and a multilayer pattern. The AMB1608C 2500Z05, for example, operates from 2300 to 2700 MHz. Its impedance—both balanced and unbalanced—is 50 Ω. Return loss is 15 dB typical. Amplitude balance is 1.0 dB typical. Its sibling, the AMB1608C 2500Z10, has many of the same specifications. The only difference is its balanced impedance, which is 100 Ω. The AMB1608C 3600Z05 and AMB1608C 3600Z10 offer balanced impedances of 50 and 100 Ω, respectively. They operate from 3300 to 3900 MHz. Samples of the baluns will begin shipping this month.

FDK Corp., Hamagomu Bldg., 5-36-11 Shimbashi, Minato-ku, Tokyo 105-8677; +81-3-3434-1271, FAX: +81-3-34341375, Internet: www.fdk.com

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