Power Demands Put the Pressure on Packaging (.PDF Download)

May 26, 2016

Microwave packaging is a term that covers a lot of ground (and relies on a reliable ground plane), and includes many configurations and material compositions. Such packages range in size from microscopic to cabinet-sized for system assemblies. But whatever the size or type, all microwave packages are designed to protect the electronic devices, components, and circuits within them. Depending on the materials and construction, they may be rated for different levels of temperature, humidity, vibration, shock, and input power. What follows is a brief glimpse at some of the different package types used across the RF/microwave industry...

Register or Sign in below to download the full article in .PDF format, including high-resolution graphics and schematics when applicable.

Sponsored Recommendations

UHF to mmWave Cavity Filter Solutions

Cavity filters achieve much higher Q, steeper rejection skirts, and higher power handling than other filter technologies, such as ceramic resonator filters, and are utilized where...

Wideband MMIC Variable Gain Amplifier

The PVGA-273+ low noise, variable gain MMIC amplifier features an NF of 2.6 dB, 13.9 dB gain, +15 dBm P1dB, and +29 dBm OIP3. This VGA affords a gain control range of 30 dB with...

Fast-Switching GaAs Switches Are a High-Performance, Low-Cost Alternative to SOI

While many MMIC switch designs have gravitated toward Silicon-on-Insulator (SOI) technology due to its ability to achieve fast switching, high power handling and wide bandwidths...

Request a free Micro 3D Printed sample part

The best way to understand the part quality we can achieve is by seeing it first-hand. Request a free 3D printed high-precision sample part.