Oscillators & Synthesizers2010 International Microwave Symposium
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Read this FAQ: Wafer-scale packaging (WSP) is a bold new approach to housing semiconductors.
WSP technology uses a semiconductor process to create a package around an IC–a package that is only slightly larger than the chip itself. It can be used with both silicon and GaAs ICs to create packaged circuits as small as 1 x 2 mm, with improved performance compared to conventional IC packages. The low height of WSP devices also makes them ideal for use in multilayer circuits. The packaging technology has already been used for ICs through 26 GHz, with the potential for operation past 100 GHz. To learn more about WSP technology, don‘t miss this new FAQ, sponsored by Avago Technologies. Read now
Featured Articles
Jul 16, 2010
SMT Couplers Build On LegacyGenerational improvements in product lines are often incremental in nature, especially for passive components. But for the third generation of Xinger hybrid and directional couplers from Anaren, the improvements from the first- and sec ...
Aug 19, 2010
Shrinking Sources Aim For Lower Noiseesigners of oscillators and synthesizers need creative ways to achieve low phase noise in smaller packages in order to serve shrinking systems. To accomplish this, some manufacturers are using advanced materials and circuit ...
Aug 19, 2010
Measuring MIMO In LTE Tx And Rx TestsFourth-generation (4G) wireless communications systems promise to support the demands of customers for increasing network capacity for voice, data, and streaming video. Systems such as Long Term Evolution (LTE) networks incorp ...
Aug 19, 2010
Portable VNAs Tune Filters In The FieldVector network analyzers (VNAs) were once found only in a facility’s equipment racks. But compact instruments like the VNA Master line from Anritsu Co. (www.us.anritsu.com) pack two-port VNA measurement capability into an enclosure about the ...
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Oct 20, 09
Technical highlights of Version 12 of HFSSTechnical highlights of Version 12 of HFSS
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