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Oscillators & Synthesizers

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  • 2010 International Microwave Symposium

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    Read this FAQ: Wafer-scale packaging (WSP) is a bold new approach to housing semiconductors.

    WSP technology uses a semiconductor process to create a package around an IC–a package that is only slightly larger than the chip itself. It can be used with both silicon and GaAs ICs to create packaged circuits as small as 1 x 2 mm, with improved performance compared to conventional IC packages. The low height of WSP devices also makes them ideal for use in multilayer circuits. The packaging technology has already been used for ICs through 26 GHz, with the potential for operation past 100 GHz. To learn more about WSP technology, don‘t miss this new FAQ, sponsored by Avago Technologies. Read now

    Featured Articles

    Jul 16, 2010

    SMT Couplers Build On Legacy

    Generational improvements in product lines are often incremental in nature, especially for passive components. But for the third generation of Xinger hybrid and directional couplers from Anaren, the improvements from the first- and sec ...

    Aug 19, 2010

    Shrinking Sources Aim For Lower Noise

    esigners of oscillators and synthesizers need creative ways to achieve low phase noise in smaller packages in order to serve shrinking systems. To accomplish this, some manufacturers are using advanced materials and circuit ...

    Aug 19, 2010

    Measuring MIMO In LTE Tx And Rx Tests

    Fourth-generation (4G) wireless communications systems promise to support the demands of customers for increasing network capacity for voice, data, and streaming video. Systems such as Long Term Evolution (LTE) networks incorp ...

    Aug 19, 2010

    Portable VNAs Tune Filters In The Field

    Vector network analyzers (VNAs) were once found only in a facility’s equipment racks. But compact instruments like the VNA Master line from Anritsu Co. (www.us.anritsu.com) pack two-port VNA measurement capability into an enclosure about the ...



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    Oct 20, 09

    Technical highlights of Version 12 of HFSS

    Technical highlights of Version 12 of HFSS



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    Microwave Meetings

    ARMMS RF & Microwave Society Conference Nov. 22-23, 2010 Rockingham Forest Hotel Northants, England Asia-Pacific Microwave Conference 2010 (APMC 2010) Dec. 7-10, 2010 Pacifico Yokohama Yokohama, Japan Radio Wireless Week Ja ...

    MEMS: Are We There Yet?

    Technology can be a wonderful thing, if properly applied. The history of this industry is rich with new technologies that were touted as “the next great thing,” but never quite changed the world the way early adopters thought it would. Those old enou ...

    Synthesizer Tunes From 2.0 To 2.5 GHz

    Frequency synthesizer model HFS-2500 from EM Research tunes from 2000 to 2500 MHz in 10-MHz steps and with better than 5-ms tuning speed. The synthesizer, which is ideal for electronic-warfare (EW) applications, delivers +5 dBm output power with bett ...

    SAW Filter Passes 1090 MHz

    Model AM1090S816 is a surface-acoustic-wave (SAW) bandpass filter from Anatech Electronics with center frequency of 1090 MHz. It offers a total passband around the center frequency of 1084 to 1096 MHz with insertion loss of 5.3 dB. The 50-Ohm filter ...

    SiGe Dividers Reach 15 GHz

    A pair of programmable dividers from Hittite Microwave Corp. supports signal-generation applications from 100 MHz to 15 GHz. Models HMC862LP3E and HMC905LP3E are silicon-germanium (SiGe) BiCMOS low-noise programmable frequency dividers supplied in 3 ...

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