This article is part of our IMS 2023 coverage.
Visit IMS Booth 2628 for a peek at StratEdge’s thermally efficient line of post-fired and molded ceramic semiconductor packages. StratEdge offers packages that operate across the spectrum from dc to 63+ GHz, while efficiently dissipating heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). The packages enable compound semiconductor devices to meet the stringent requirements in applications such as defense, satellite, test and measurement, automotive, and down-hole.
StratEdge’s molded ceramic packages provide a suitable solution for spaceborne and defense applications. These can be manufactured with thermally enhanced metal bases to ensure efficient heat dissipation. Meanwhile, its post-fired ceramic packages feature electrical transition designs that greatly minimize signal losses.
For more information, visit the company's website.
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