Remtec, perhaps best known for its Plated Copper On Thick Film (PCTF(r)) ceramic substrates
and packages, has announced the development of a new etchable materials capability that permits
circuit designers to integrate more functions and improve performance while reducing package
size. As the company's President, Nahum Rapoport, reported, "Now designers can select the most
cost-effective combination of PCTF(r) metalization options, such as etchable conductors, screen
printable thick films and plated copper, solid plugged via holes, at a cost significantly lower than
comparable thin film circuits".
Using this new Remtec capability, microcircuit designers can achieve the performance of thin-film
products with a number of added features, including enhanced power dissipation and a wider range
of resistor values. The process can realize conductor lines and spacing with width of 0.02 inches
and tolerances of +/- 0.0002 inches for performance to 32 GHz and higher.
Remtec (www.remtec.com)
and packages, has announced the development of a new etchable materials capability that permits
circuit designers to integrate more functions and improve performance while reducing package
size. As the company's President, Nahum Rapoport, reported, "Now designers can select the most
cost-effective combination of PCTF(r) metalization options, such as etchable conductors, screen
printable thick films and plated copper, solid plugged via holes, at a cost significantly lower than
comparable thin film circuits".
Using this new Remtec capability, microcircuit designers can achieve the performance of thin-film
products with a number of added features, including enhanced power dissipation and a wider range
of resistor values. The process can realize conductor lines and spacing with width of 0.02 inches
and tolerances of +/- 0.0002 inches for performance to 32 GHz and higher.
Remtec (www.remtec.com)