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  • Jun. 5, 2013
    Article

    Manage Growing EM Radiation Levels

    Careful choice of shielding materials can eliminate interference problems in a cost-effective manner....More
  • Jun. 4, 2013
    Article

    Corralling Materials For Microwave Circuits

    Understanding dielectric material parameters can help simplify the process of choosing the right printed-circuit-board (PCB) material for a design....More
  • Jun. 3, 2013
    Article

    Absorbers Highlight Material Showcase

    A wide range of microwave absorbers provides shielding of unwanted signals from HF through millimeter-wave frequencies....More
  • Apr. 3, 2013
    Article

    Handling The Heat In RF/MW Circuits

    Thermal management in high-frequency circuits depends on careful choice of circuit and packaging materials to remove heat and preserve high performance levels....More
  • Oct. 10, 2012
    Article

    Materials Made For The Battlefield

    By understanding how different circuit-material parameters translate under battlefield conditions, those materials can be more easily selected for military applications....More
  • Sep. 28, 2012
    Article

    Metamaterials-Based Approach Promises Satellite Connection

    Imagine that a new antenna technology truly made “broadband everywhere” possible. As the most recent spinout from Intellectual Ventures (IV), Kymeta just closed a $12-million funding round to develop and bring to market IV’s Metamaterials Surface Antenna Technology (MSA-T)....More
  • Sep. 26, 2012
    Article

    Webinar Touts Efficiency Of In-House Prototyping 2

    Building printed-circuit boards (PCBs) is part of any electronic product development plan. But while some companies farm their PCBs to outside “board shops,” others have learned the usefulness of in-house PCB prototyping capability, courtesy of machines from LPKF Laser & Electronics....More
  • Aug. 21, 2012
    Article

    “Magic” Material Tames Thermal Problems

    Thermal management in electronic circuits can be challenging, especially when taking into account the many different materials in those circuits—each with its own temperature coefficients. But a new silicone elastomer developed by materials wizard NuSil Technology LLC, EPM1-2493, can be used to adhere materials with different coefficients of thermal expansion (CTE) as a stress remover....More
  • Aug. 8, 2012
    Article

    Download A Free Calculator 10

    Visitors to the IPC Midwest Conference & Exhibition (August 22-23) will have the opportunity to learn more about circuit-board materials, courtesy of a quick visit to Rogers Corp. at booth  No. 503. The firm is promoting its Theta® circuit materials, suitable for both high-frequency analog and high-speed digital applications....More
  • Aug. 8, 2012
    Article

    Soldering Skills Earn Dollars

    Hand soldering is still a skill with tremendous value, even in this age of automated assembly. Indeed, any engineer who has worked on their own prototype designs will proudly point to their hand-soldering efforts. To honor engineers who take pride in this skill, the IPC Midwest Conference & Exhibition is sponsoring the Second Annual IPC Midwest Soldering Competition, taking place in Schaumburg, IL from August 22-23....More
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GaN Roundtable: The State of GaN Reliability Today

Wednesday, April 3rd, 2013, 2:00 pm ET. Gallium nitride (GaN) has come a long way over the past few years in terms of affordability, industry acceptance and, in particular, reliability. In this webcast roundtable, a panel of expert speakers will assess the current state of GaN reliability, along with offering predictions for its future.

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