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  • Apr. 3, 2013
    Article

    Handling The Heat In RF/MW Circuits

    Thermal management in high-frequency circuits depends on careful choice of circuit and packaging materials to remove heat and preserve high performance levels....More
  • Oct. 10, 2012
    Article

    Materials Made For The Battlefield

    By understanding how different circuit-material parameters translate under battlefield conditions, those materials can be more easily selected for military applications....More
  • Sep. 28, 2012
    Article

    Metamaterials-Based Approach Promises Satellite Connection 1

    Imagine that a new antenna technology truly made “broadband everywhere” possible. As the most recent spinout from Intellectual Ventures (IV), Kymeta just closed a $12-million funding round to develop and bring to market IV’s Metamaterials Surface Antenna Technology (MSA-T)....More
  • Sep. 26, 2012
    Article

    Webinar Touts Efficiency Of In-House Prototyping 3

    Building printed-circuit boards (PCBs) is part of any electronic product development plan. But while some companies farm their PCBs to outside “board shops,” others have learned the usefulness of in-house PCB prototyping capability, courtesy of machines from LPKF Laser & Electronics....More
  • Aug. 21, 2012
    Article

    “Magic” Material Tames Thermal Problems

    Thermal management in electronic circuits can be challenging, especially when taking into account the many different materials in those circuits—each with its own temperature coefficients. But a new silicone elastomer developed by materials wizard NuSil Technology LLC, EPM1-2493, can be used to adhere materials with different coefficients of thermal expansion (CTE) as a stress remover....More
  • Aug. 8, 2012
    Article

    Download A Free Calculator 11

    Visitors to the IPC Midwest Conference & Exhibition (August 22-23) will have the opportunity to learn more about circuit-board materials, courtesy of a quick visit to Rogers Corp. at booth  No. 503. The firm is promoting its Theta® circuit materials, suitable for both high-frequency analog and high-speed digital applications....More
  • Aug. 8, 2012
    Article

    Soldering Skills Earn Dollars

    Hand soldering is still a skill with tremendous value, even in this age of automated assembly. Indeed, any engineer who has worked on their own prototype designs will proudly point to their hand-soldering efforts. To honor engineers who take pride in this skill, the IPC Midwest Conference & Exhibition is sponsoring the Second Annual IPC Midwest Soldering Competition, taking place in Schaumburg, IL from August 22-23....More
  • Jul. 11, 2012
    Article

    Conductive Foams Shield Cell Phones 1

    Condux Plus™ electrically conductive foams provide excellent electrical conductivity, consistent mechanical properties, and outstanding electromagnetic (EM) shielding capabilities. These attributes enhance conductivity and improve shielding performance in small wireless devices, such as cellular telephones. The materials are available in different thicknesses (0.33, 0.53, and 0.73 mm) to serve a variety of circuit and package configurations. They feature consistent and reliable connectivity while also offering excellent mechanical stability over time and temperature....More
  • Jun. 14, 2012
    article
    Microwaves and RF

    Materials Solutions Form Multilayer Circuits

    Substrate materials are the foundations for RF/microwave circuits. Long-time supplier Rogers Corp. will be on hand at the 2012 IMS (booth No. 2902) with several high-performance materials, including their new 2929 bondply. The 2929 material is a ......More
  • May 17, 2012
    article
    Microwaves and RF

    Navigating Multilayer Microwave PCB Tradeoffs 1

    There are numerous ways to assemble multilayer microwave printed circuits, depending on whether cost or performance is important, and when factors such as ease of fabrication and reliability are critical....More
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Wednesday, April 3rd, 2013, 2:00 pm ET. Gallium nitride (GaN) has come a long way over the past few years in terms of affordability, industry acceptance and, in particular, reliability. In this webcast roundtable, a panel of expert speakers will assess the current state of GaN reliability, along with offering predictions for its future.

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