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May 27, 2016
Microwaves and RF

Inside Track with Paul Hart, Senior Vice President and General Manager, RF Power Business, NXP Semiconductors (.PDF Download)  

Paul Hart is Senior Vice President and General Manager of the Radio Frequency business at NXP. He is responsible for maximizing NXP’s leadership position in RF Power and identifying new market opportunities to drive growth. We talked with him about the latest at NXP... Register or Sign in below to download the full article in .PDF format, including high-resolution graphics and schematics when applicable....More
May 26, 2016
Microwaves and RF

Power Demands Put the Pressure on Packaging (.PDF Download)  

Microwave packaging is a term that covers a lot of ground (and relies on a reliable ground plane), and includes many configurations and material compositions. Such packages range in size from microscopic to cabinet-sized for system assemblies. But whatever the size or type, all microwave packages are designed to protect the electronic devices, components, and circuits within them. Depending on the materials and construction, they may be rated for different levels of temperature, humidity, vibration, shock, and input power....More
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