Ceramic substrate and package supplier Remtec recently marked 20 years in the industry, serving both commercial and military customers. The firm, known for its plated copper on thick film (PCTF) packaging technology, was founded in 1990 and issued a patent for its PCTF technology in 1994. According to Remtec President Nahum Rapoport, "Over these years, we have focused on design, development and manufacture of reliable, cost-effective products providing a multitude of ceramic packaging solutions that meet the changing and demanding needs in DC power electronics, RF/microwave packaging and optoelectronics."