A line of custom hermetic surface-mount-technology (SMT) packages from Remtec is ideal for high-reliability applications in aerospace, military, and industrial markets. The fully hermetic, low-profile packages can withstand power levels to 100 W and current to 75 A. They can handle frequencies to 10 GHz and beyond. Packages are available for multichip modules (MCM), with ball grid array (BGA) construction, and with SMT leadless and leaded input/output connections and high-voltage insulation. The SMT packages serve as a viable alternative to co-fired ceramic packages as well as metal-based glass-to-metal hermetic enclosures.