Wafer-scale packaging (WSP) is a bold new approach to housing semiconductors. It uses a semiconductor process to create a package around an ICa package that is only slightly larger than the chip itself. It can be used with both silicon and GaAs ICs to create packaged circuits as small as 1 x 2 mm, with improved performance compared to conventional IC packages. The low height of WSP devices also makes them ideal for use in multilayer circuits. The packaging technology has already been used for ICs through 26 GHz, with the potential for operation past 100 GHz.
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