Integrated circuits (ICs) provide tremendous functionality in small sizes. But they are susceptible to damage and short operating lifetimes unless properly packaged, and that is the main message of a Special Report in the February issue of Microwaves & RF, "Perusing Package Options for ICs."

The article not only lists some of the major suppliers of high-frequency IC package houses, but also how some leading microwave IC designers have incorporated packages into their designs. The report also tracks some of the trends in combining multiple functions and ICs in the form of system-in-package (SiP) and multichip-module (MCM) devices.