Rogers Corporation has double-barrel action in its booth 2920 at the 2010 IMS with both its Advanced Circuit Materials (ACM) Division and Thermal Management Solutions (TMS) Division represented. In addition to its many proven lines of high-frequency circuit-board materials, the ACM Division is offering RT/duroid 5880LZ, RT/duroid 6202PR, and RO4360 laminate. The TMS Division is helping RF/microwave engineers get the heat out of their high-power designs with their innovative HEATWAVE metal matrix composites.

RT/duroid 5880LZ is a PTFE-based composite material designed for applications requiring light-weight circuit boards. The material has a dielectric constant of 1.96 at 10 GHz and is ideal for stripline and microstrip designs, including airborne antennas. RT/duroid 6202PR laminates are suited for designs requiring outstanding mechanical and electrical stability, and are ideal for multilayer circuits. RO4000 laminates offer the processing simplicity of FR-4, with improved electrical performance. For example, RO4360 has the high dielectric constant, 6.15 at 2.5 and 10 GHz, needed for designing miniature antennas and other circuits. And for thermal issues, ask the folks at the TMS Division about their HEATWAVE aluminum silicon carbide (AlSiC) metal matrix composite (MMC) thermal-management material. The light-weight material is supplied with thermal conductivities from 170 to 230 W/mK and is available with tightly controlled coefficient of thermal expansion (CTE) from 5 to 14 ppm/K.