Packaging innovator StratEdge is displaying its lines of high-performance, high-power packages for applications past 50 GHz at booth 2021 at the 2010 IMS. The rugged packages meet MIL-STD 883 and MIL-PRF 38534 testing standards for use in high-reliability military and space applications. The firm's Power Package products feature high-thermal-conductivity bases that can better dissipate the heat produced by high-power devices, such as gallium nitride (GaN) transistor chips.

The company is also announcing the SM family of packages for aerospace, avionics, automotive, and telecommunications applications. Rated for performance past 30 GHz, the first package in the family measures 5 x 5 mm with 28 input/output ports. The packages, which meet military standards for hermeticity, incorporate a metal plug in the base that allows a direct ground path for enhanced electrical performance. Plans include both smaller and larger package versions. According to StratEdge President Tim Going, "StratEdge's new SM packages give designers an alternative to plastic over-molded packages, enable them to get superior electrical performance, and are cost effective because of the ease of repair and rework."