Remtec, perhaps best known for its Plated Copper On Thick Film (PCTF(r)) ceramic substrates 
and packages, has announced the development of a new etchable materials capability that permits 
circuit designers to integrate more functions and improve performance while reducing package 
size.  As the company's President, Nahum Rapoport, reported, "Now designers can select the most 
cost-effective combination of PCTF(r) metalization options, such as etchable conductors, screen 
printable thick films and plated copper, solid plugged via holes, at a cost significantly lower than 
comparable thin film circuits".

Using this new Remtec capability, microcircuit designers can achieve the performance of thin-film 
products with a number of added features, including enhanced power dissipation and a wider range 
of resistor values. The process can realize conductor lines and spacing with width of 0.02 inches 
and tolerances of +/- 0.0002 inches for performance to 32 GHz and higher. 

Remtec (www.remtec.com)