A line of hermetically sealable, high-temperature-cofired-ceramic (HTCC) packages incorporate air cavity designs for low loss at high frequencies. These quad-flat-pack-no-lead (QFN) packages are available in six sizes from 3 to 8 mm with standard JEDEC MO-220 footprints. The maximum insertion loss is 0.5 dB from DC to 18 GHz, 1.5 dB from 18 to 35 GHz, and 4 dB from 35 to 40 GHz. The packages—which exhibit higher thermal conductivity than low-temperature-cofired-ceramic (LTCC) packages, making them well suited for high-power applications—are available with either a plain seal for epoxy or metallized grounded seal ring for solder lid attachment. Lids are also available.

Barry Industries, Inc., 60 Walton St., Attleboro, MA 02703; (508) 226-3350, FAX: (508) 226-3317.