Substrate materials are the foundations for RF/microwave circuits. Long-time supplier Rogers Corp. will be on hand at the 2012 IMS (booth No. 2902) with several high-performance materials, including their new 2929 bondply. The 2929 material is a thin-film adhesive for high-performance, high-reliability, multilayer circuits. It features a low dielectric constant of 2.9, matching the laminate layers it is bonding, and low loss tangent of less than 0.003. It is well suited for bonding the company's various high-performance laminate materials, including Rogers' RT/duroid® 6000, RO4000® and RO3000® series laminates.
Rogers will also have on display its new RO4835® high-frequency laminate, formulated with improved oxidation resistance. Ideal for applications requiring high electrical stability over time and temperature, RO4835 laminates exhibit a dielectric constant of 3.48 at 10 GHz and low loss tangent of 0.0037 at 10 GHz. They are RoHS-compliant, do not require special preparation, and can be processed using standard methods.
Rogers will also treat 2012 IMS exhibit visitors to two MicroApps presentations. The first is scheduled at 11:05 a.m. Tuesday, June 19 by John Coonrod, Rogers' Market Development Engineer ("Bonding Materials Used in Multi-layer Microwave PCB Applications"). The second, scheduled for 3:05 p.m. Wednesday, June 20, is by Rogers' Associate Research Fellow, Allen Horn III ("Reducing Active Device Temperature Rise and RF Heating Effects with High Thermal Conductivity, Low Loss Circuit Materials").