Silicon technology now offers a path to both capable and economical systems operating at 200 GHz and beyond. This option has arisen because of recent progress in complementary-metaloxide- semiconductor (CMOS) integrated circuits and ......More
EUROPE-A three-year European project dubbed DOTFIVE is focusing on the RTD activities necessary to move the silicon-germanium (SiGe) heterojunction-bipolar-transistor (HBT) into the frequency range of 0.5 THz (500 GHz) at room temperature. Using ......More
This highly integrated microwave assembly employs advanced SMT fabrication techniques to reduce size, weight, and power to previously unattainable levels....More
Several sessions at the upcoming 2010 IEDM will focus in improvements in high-frequency device performance and how to model them more accurately and effectively....More
These digitally controlled circuits provide precise control of amplitude levels over a 31.5-dB range through 1 GHz for applications in wireless infrastructure equipment....More
The industrys first high-density, rad-hard reconfigurable field-programmable gate array offers an option to rad-hard ASICs in space applications....More
The Bluetooth platform developed by CSR is a single-mode, single-chip low-energy platform. Low-energy Bluetooth systems are important to the wireless communications sector for applications like remote controls, health and well-being devices, ......More
WITH ADVANCED METERING INFRASTRUCTURE (AMI) and other applications in the Industrial, Scientific, and Medical (ISM) band gaining in popularity, the RF3858 front-end module is a promising solution for portable equipment in need of size reduction. It ......More
This compact multiband, multimode transceiver simplifies 2G, 3G, UMTS, EDGE, and LTE handset designs by doing away with many of the amplifiers and SAW filters commonly found in conventional architectures....More
With the increasing availability of ultra-highspeed digital-to-analog converters (DACs), a direct digital synthesizer (DDS) can generate waveforms exceeding 1 GHz. Until now, however, no higheroutput DDSs have been able to provide the desired ......More
AMONG THESE ACHIEVEMENTS, NXP also is celebrating a production milestone with its ICODE chip. Recently, the company shipped its one-billionth component. In an effort to maintain this device's success, NXP has launched the ICODE SLIx ......More
Eindhoven, Netherlands: By the end of this year, NXP Semiconductors plans to release 50 different products based on its new silicon germanium: carbide (SiGe:C) process technology. The process, dubbed QUBiC4, is designed to meet the needs of ......More
This long-time supplier of discrete semiconductor devices is entering the GaAs MMIC market focused on solutions for wireless macro cells, repeaters, and femto cells....More
From components in imaging systems to devices for telecommunications infrastructure, opportunities in healthcare abound for microwave and RF firms....More
Wafer-scale packaging (WSP) is a bold new approach to housing semiconductors. It uses a semiconductor process to create a package around an ICa package that is only slightly larger than the chip itself. It can be used with both silicon and GaAs ICs to ......More
According to Germany-based MEMS foundry X-Fab, one of its prime assets is the in-house co-existence of MEMS and CMOS mixed-signal processes. Because MEMS devices are manufactured using techniques that are similar to those employed for ICs, ......More
A Spanish company, Baolab Systems, has pioneered a new technology that is expected to cut the cost of microelectromechanical systems (MEMS) while strongly impacting mobile communication design. Key to this breakthrough is the company's ability to ......More
LAFOX, ILRichardson Electronics Ltd. has teamed with Scintera, Inc. to bring Scintera's SC1887 system-on-a-chip (SoC) to market. The SC1887 promises to deliver power-amplifier (PA) linearity improvements without requiring access to ......More
For Global Foundriesin conjunction with ARMSpain's mobile-communications techfest offered an opportunity to unveil a system-on-a-chip (SoC) technology for powering next-generation wireless products and applications. The chip manufacturing ......More
Although often overlooked, the package is an inseparable part of an RF/microwave semiconductor device, contributing to electrical performance and long-term reliability....More
GENEVA, SWITZERLANDSmart-card integrated-circuit (IC) maker STMicroelectronics has developed a low-power processor chip dedicated to managing SIM data for machine-to-machine (M2M) cellular communications. Recent research is suggesting that ......More
A wide range of silicon- and GaAs-based semiconductor processes are available from open foundries, for fabricating low-noise and power devices and circuits through millimeter-wave frequencies....More
MALIBU, CA HRL scientists have fabricated and demonstrated graphene- on-silicon field-effect transistors (FETs) at full wafer scale. This work is part of the Carbon Electronics for RF Applications (CERA) program, which is sponsored by the Defense ......More
Available in chip and QFN-packaged forms, these MMIC devices provide many of the fundamental functions needed to assemble compact commercial or military microwave and millimeter-wave radios....More
GaN Roundtable: The State of GaN Reliability Today
Wednesday, April 3rd, 2013, 2:00 pm ET. Gallium nitride (GaN) has come a long way over the past few years in terms of affordability, industry acceptance and, in particular, reliability. In this webcast roundtable, a panel of expert speakers will assess the current state of GaN reliability, along with offering predictions for its future.
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Agilent Technologies Complex Modulation Generation with Low Cost Arbitrary Waveform Generators - Agilent's Trueform Architecture for Wireless Applications
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