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  • Jul. 23, 2009
    article
    Microwaves and RF

    Interplex Acquires Quantum Leap Packaging

    At the International Microwave Symposium (IMS) this past June in Boston, MA, details were published on Freescale's validation and qualification of Quantum Leap Packaging's (QLP's) materials and packaging technology. Compared to ceramic-based packages, ......More
  • Jun. 17, 2009
    article
    Microwaves and RF

    Launching TM Mode Onto A Single Conductor, Part 2

    Part 2 of this three-part series digs deeper into the nature of TM mode propagation along the surface of single-conductor transmission lines and the design of practical launchers....More
  • Mar. 27, 2009
    article
    Microwaves and RF

    High-Frequency Laminates Showcased At CTIA 2009

    Rogers Corp. will feature a variety of its high-performance materials at CTIA 2009, in Las Vegas, NV, April 1-3, 2009 (Booth 1074). The company specializes in high-frequency laminates for circuit boards in amplifiers, microwave radios, base-station ......More
  • Mar. 19, 2009
    article
    Microwaves and RF

    Microwave Materials Move Beyond Thermal Management

    To serve higher-frequency designs, emerging materials are maintaining low loss and stability while enabling engineers to coax more performance out of smaller products....More
  • Feb. 24, 2009
    article
    Microwaves and RF

    Making Manufacturing Choices For X-Band BPFS

    Understanding the properties of the materials for fabricating high-frequency filters, such as substrates and conductors, can improve the simulation accuracy and hardware performance....More
  • Feb. 24, 2009
    article
    Microwaves and RF

    Form Bandpass Filters On Glass Substrates

    Glass offers great potential as an alternative to traditional high-frequency substrate materials, allowing the design of high-performance circuits using standard integrated-circuit processes....More
  • Dec. 12, 2008
    article
    Microwaves and RF

    ICP Etching Reduces MM-Wave Substrate Loss

    FOR GALLIUM-ARSENIDE(GAAS) coplanar passive devices, the design methods used in centimeterwave frequencies have been proven to work for millimeter-wave frequencies up to W-band (75 to 110 GHz). Those same methods can be applied to CMOS coplanar ......More
  • Dec. 4, 2008
    article
    Microwaves and RF

    DVB Library Added To VSS Software Tool

    In celebration of the FCC's mandate of digital video broadcast (DVB) for everyone in February 2009, Applied Wave Research (AWR) has added DVB analysis capability to its popular Visual System Simulator (VSS) design software suite. The DVB library is ......More
  • May 13, 2008
    article
    Microwaves and RF

    Multilayer Microstrip Forms Tunable Bandstop Filters

    These straightforward guidelines show how to design and analyze a new structure for tunable bandstop filters using multilayer microstrip with a metallic diaphragm....More
  • May 13, 2008
    article
    Microwaves and RF

    Chip-Scale Packaging Approach Cuts Losses 1

    This innovative, semiconductor-based chip-scale-packaging technology promises extreme miniaturization while minimizing signal losses for a wide range of RF/microwave components....More
  • Mar. 12, 2008
    article
    Microwaves and RF

    Metamaterials Show Potential For Planar Components

    Metamaterials intrigue researchers for their potential to fabricate tunable and wideband passive components. Because of line parasitics, the reactive elements responsible for the left-handed (LH) band exhibit a forward or right-handed (RH) ......More
  • Mar. 12, 2008
    article
    Microwaves and RF

    Microwave Materials Help Build An Industry

    Materials suppliers are constantly refining their recipes in search of products that offer greater value and increased reliability for a variety of commercial, industrial, and military applications....More
  • Feb. 21, 2008
    article
    Microwaves and RF

    Fine Tuning Those Microwave Materials

    Microwave materials are to the high-frequency industry what lumber and drywall are to the residential construction industry. They are fundamental to the industry's growth, let alone its survival. Materials such as ceramic and plastic printed-circuit ......More
  • Feb. 13, 2008
    article
    Microwaves and RF

    Gore Celebrates 50 Years Of PTFE

    The ingenious new-product ideas of their founder continue to this day at W.L. Gore & Associates, all based on a single material: PTFE....More
  • Sep. 12, 2007
    article
    Microwaves and RF

    PCB Layout Enables Lowest Thermal Resistance

    Printed-Circuit Board (PCB) layout is critical to both thermal and RF performance. It is therefore crucial that designers consider the heat source as well as how the heat will be removed before the electromechanical design is finished. Texas Instruments, ......More
  • Aug. 14, 2007
    article
    Microwaves and RF

    Predict Resonances Of Shielded PCBs

    The equations presented here make it possible to predict and analyze the resonant behavior of microwave circuits enclosed in rectangular shields....More
  • Aug. 14, 2007
    article
    Microwaves and RF

    BeO Takes The Heat In RF Transistor Packages

    Even with challenges from other technologies, beryllium oxide (BeO) remains the insulating material of choice for the most demanding RF power transistor packages....More
  • Aug. 10, 2007
    article
    Microwaves and RF

    August 9, 2007 Newsletter

    Microwaves & RF UPDATE | August 9, 2007 Jack Browne, Technical Director Free Agilent White Paper: Perfecting Pulsed RF Radar Measurements ......More
  • Aug. 9, 2007
    article
    Microwaves and RF

    PCB Industry To Flourish

    Visant Strategies has just published a report predicting robust growth for the printed-circuit- board (PCB) industry. The report, "Printed Circuit Board: World Outlook," sees global revenues for PCBs growing from over $50 billion in 2007 to more than ......More
  • Apr. 26, 2007
    article
    Microwaves and RF

    Remtec Develops Etchable Materials Capability

    Remtec, perhaps best known for its Plated Copper On Thick Film (PCTF(r)) ceramic substrates and packages, has announced the development of a new etchable materials capability that permits circuit designers to integrate more functions and improve ......More
  • Apr. 12, 2007
    article
    Microwaves and RF

    Developing Designs For RFID Transponder Using DTMOS

    The use of DTMOS as part of a standard CMOS process shows great promise for fabricating low-power, low-cost analog and digital circuitry for UHF RFID transponders....More
  • Mar. 15, 2007
    article
    Microwaves and RF

    PCTF Approach Saves MW/RF Component/Module Costs

    This advanced ceramic SMT packaging approach offers high performance and reliability but with impressive cost benefits in small-to-medium-volume production....More
  • Dec. 28, 2004
    article
    Microwaves and RF

    Novel Contacts Aid Lead-Free Packaging

    This simple yet elegant solution to achieving good electrical and ground connections in miniature high-frequency components clears the way for lead-free package processing....More
  • Aug. 27, 2004
    article
    Microwaves and RF

    Liquid-Crystalline Polymers Bond Multilayer Circuits

    Flexible low-cost, low-loss analog and digital multilayer circuits can be fabricated well into the millimeter-wave region thanks to a line of LCP laminates and bonding films....More
  • Apr. 7, 2004
    article
    Microwaves and RF

    Infineon Cools Down LDMOS Transistors

    A line of thermally-enhanced lateral-diffused metal-oxide-semiconductor (LDMOS) RF power transistors from Infineon Technologies (Morgan Hill, CA) exhibits 15 to 30 percent lower thermal resistance from the device junction to the case compared to ......More

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