Technologies

Packaging and Substrate Solutions Gain Ground

March 10, 2015

A firm specializing in packaging and substrate design and manufacturing has added to its capabilities.

A firm known for its ceramic packaging and substrate solutions has added a number of capabilities to its lineup, including copper-filled viaholes, copper-coated bore holes, and solder mask and assembly options. These capabilities enhance the design capabilities for packages and printed-circuit boards (PCBs) while also improving the reliability of designed based on the company’s manufacturing processes. The packages and substrates use the company’s plated copper on thick and thin film (PCTF) metallization for high reliability and effective thermal management.

Remtec, Inc., 100 Morse St., Norwood, MA 02062; (781) 762-9191, FAX: (781) 762-9777

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.