Semiconductors

Jun. 13, 2013

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Image Gallery: TriQuint at IMS 2013

TriQuint showcased and demonstrated their latest products at the International Microwave Symposium 2013 in Seattle, WA.
Jun. 13, 2013

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Image Gallery: NXP at IMS 2013

NXP showcased and demonstrated their latest products at the International Microwave Symposium 2013 in Seattle, WA.
Jun. 13, 2013

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Image Gallery: Freescale at IMS 2013

Freescale showcased and demonstrated their latest products at the International Microwave Symposium 2013 in Seattle, WA.
Jun. 13, 2013

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Image Gallery: Cree at IMS 2013

Cree showcased and demonstrated their latest products at the International Microwave Symposium 2013 in Seattle, WA.
Jun. 10, 2013

Article

New Development in Semiconducting Film for 2D Electronic Components

Scientists have made advancements in the controlled growth of molybdenum disulfide (MDS), a semiconductor film used in the creation of 2D electronic components with atom-thick circuits....More
May 30, 2013

Article

Element Six Acquires Group4 Labs to Strengthen Portfolio of Semiconductor Synthetic Diamond Materials

Element Six has acquired Group4 Labs to strengthen their portfolio of semiconductor materials, with the heat from GaN devices effectively dissipated by the superior thermal properties of synthetic diamond materials....More
May 9, 2013

Article

GaN-On-Diamond Breakthrough Promises To Shrink Transistors

The feasibility of GaN-on-diamond HEMT devices has been proven with the successful transfer of a semiconductor epitaxial overlay onto a synthetic diamond substrate....More
May 4, 2013

Article

Connected Cars Get Green Light 1

Support is growing for car-to-car and car-to-infrastructure communication standards, creating traction in Europe that should quickly widen to encompass most of the world....More
Apr. 29, 2013

Article

Modular SoC Design Integrates RF Transceiver In 32-nm Process

This system on a chip (SoC) integrates diverse digital, analog, and RF blocks on a single die, allowing the RF transceiver and associated RF front end to co-exist with the rest of the SoC while maintaining RF performance....More
Apr. 26, 2013

Article

1-V Transceiver Exceeds Needs Of IEEE 802.15.6 Narrowband/BLE PHY

Fabricated in 0.13-micron CMOS and measuring just 5.9 square mm, this transceiver satisfies the IEEE 802.15.6 narrowband PHY standard as well as Bluetooth Low Energy to serve WBAN applications....More