Conquering USB 3.0 Physical Layer Test Challenges

Sponsored by Agilent Technologies

Why this webcast is important:
USB 3.0 is hitting the mainstream market in a big way in 2012. With native Windows 8 support for USB 3.0 and Intel’s integrated chipset shipping this year, SuperSpeed USB 3.0 adoption rates will really take off.

In this webcast we will provide a USB 3.0 industry update as well as cover the latest physical layer compliance testing requirements and challenges for USB 3.0. Also, the USB 3.0 specification now includes several Engineering Change Notices (ECNs). We will review those that impact physical layer testing and describe the test method changes that will be required to meet the new requirements. Lastly we will cover advanced testing topics to help you understand how to determine true transmitter and receiver margins by removing test fixture and cable losses from your measurements.

Who should view this webcast:
USB design engineers, signal integrity engineers, quality engineers, validation engineers, test engineers, architects, project managers, program managers, application managers, application engineers.

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