Superstrate Antenna Suitable For Integration With MM-Wave Transceivers

Jan. 16, 2007
MILLIMETER-WAVE frequencies have long held the promise of generous bandwidths, if only the technology could be made more affordable. With that goal in mind, Thomas Zwick and researchers from the IGM Thomas J. Watson Research Center (Yorktown Heights, NY) ...

MILLIMETER-WAVE frequencies have long held the promise of generous bandwidths, if only the technology could be made more affordable. With that goal in mind, Thomas Zwick and researchers from the IGM Thomas J. Watson Research Center (Yorktown Heights, NY) set out to develop a broadband planar antenna for use in the 60-GHz Industrial-Scientific-Medical (ISM) band. Their design, which is suitable for integration with millimeter-wave transceiver integrated circuits (ICs), is printed on the bottom of a dielectric superstrate with a ground plane below, providing both wide bandwidth and high efficiency. It is fabricated on a planar printed-circuit board (PCB) which allows very-low-cost mass production.

The researchers developed a new antenna concept with a structure manufactured as a PCB in a dielectric substrate that can be flipped onto an IC or chip carrier. The ground of the IC package base also acts as the reflecting ground for the antenna. The superstrate has a material with low dielectric constant between the antenna and the ground plane and a higher dielectric constant material above the antenna structure.

The researchers tried two design approaches. The first involved a folded dipole with coplanar strip (CPS) feed and broadband balun. The second was a dual folded dipole array. Good agreement between computer simulations and measurements was found for both designs, with both approaches yielding better than 90-percent efficiency. See "Broadband Planar Superstrate Antenna for Integrated Millimeterwave Transceivers," IEEE Transactions on Antennas and Propagation, October 2006, Vol. 54, No. 10, p. 2790.

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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