Laser System Depanels PCBs

July 1, 2010
The MicroLine 1000S laser system from LPKF provides a cost-effective method for ultraviolet-laser depaneling of assembled printed-circuit boards (PCBs). The UV laser system processes substrates as large as 250 x 350 mm using a 5-W laser beam that is 20 ...

The MicroLine 1000S laser system from LPKF provides a cost-effective method for ultraviolet-laser depaneling of assembled printed-circuit boards (PCBs). The UV laser system processes substrates as large as 250 x 350 mm using a 5-W laser beam that is 20 microns in diameter. The laser operates at a wavelength of 355 nm. It can cut substrates close to delicate components without causing stress, allowing high assembly densities to be realized. According to Dr. Ingo Bretthauer, Chairman of the LPKF Board of Directors, "The MicroLine 1000 S combines a low entry-level price with the highest cutting quality and superior process capabilities. At the same time it is especially flexible and therefore suited for high manufacturing variance." This tool-less method of processing electronic substrates makes it possible to create almost any type of contour without thermal or mechanical stress.

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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