Rogers Displays Old And New At IMAPS

March 4, 2009

If circuit materials are the fundamental building blocks of electronics, then the interest should be high at the Rogers Corp. booth at the IMAPS Device Packaging show next week (March 10-11, 2009, Radisson Fort McDowell Resort and Casino, Scottsdale/Fountain Hills, AZ). Rogers plans on showing a mix of proven and new materials at the show, including its well-established RO4000 and ULTRALAM laminate materials for high-speed, high-frequency wireless and telecommunications applications.

In addition, Rogers will show its recently introduced RO2808 ceramic-filled PTFE circuit-board material with dielectric constant of 7.6 and high stability comparable to low-temperature-cofired-ceramic (LTCC) materials. With a loss tangent of 0.002 or less, the material can be supplied as 1-mil-thick boards for low-profile designs.

About the Author

Jack Browne

Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.