Tester Checks Femtocell Chips

June 10, 2010
A measurement solution developed jointly by Agilent Technologies and picoChip aims at high-volume testing of devices for third-generation (3G) cellular femtocell products. It incorporates Agilent's N7310A chipset control software and picoChip's picoXcell ...

A measurement solution developed jointly by Agilent Technologies and picoChip aims at high-volume testing of devices for third-generation (3G) cellular femtocell products. It incorporates Agilent's N7310A chipset control software and picoChip's picoXcell semiconductors and software. Agilent's software works with the firm's MXA, EXA, MXG and ESG analyzers and signal generators. picoChip's PC6201 manufacturing bundle includes a SCPI-based manufacturing interface, controlling test PHY and a radio application-programming interface. According to David Maidment, Vice President of Product Management for picoChip, "Bringing a consumer market approach to the network infrastructure business is not an easy transition. This new manufacturing test solution is a key part of our ability to provide the proven, fully tested solutions that the market requires."

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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