Switch Matrix Fits On An MIC

April 12, 2011
Microwave integrated circuit (MIC) technology has been applied to the fabrication of an extremely compact solid-state 8 x 2 antenna switch matrix by American Microwave Corp. The MIC hybrid switch matrix is produced from a single substrate for consistent ...

Microwave integrated circuit (MIC) technology has been applied to the fabrication of an extremely compact solid-state 8 x 2 antenna switch matrix by American Microwave Corp. The MIC hybrid switch matrix is produced from a single substrate for consistent performance with frequency and temperature. The 8 x 2 matrix provides better than 60 dB isolation between ports with less than 2 dB insertion loss at 1 GHz. The tiny device includes custom logic circuitry as well as fault-detection circuitry. Since the MIC is built on both sides of the substrate, a variety of other circuit functions can be added to a single-substrate design, including amplifiers, filters, bias tees, and power splitters/combiners.

About the Author

Jack Browne | Technical Contributor

Jack Browne, Technical Contributor, has worked in technical publishing for over 30 years. He managed the content and production of three technical journals while at the American Institute of Physics, including Medical Physics and the Journal of Vacuum Science & Technology. He has been a Publisher and Editor for Penton Media, started the firm’s Wireless Symposium & Exhibition trade show in 1993, and currently serves as Technical Contributor for that company's Microwaves & RF magazine. Browne, who holds a BS in Mathematics from City College of New York and BA degrees in English and Philosophy from Fordham University, is a member of the IEEE.

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