Master Bond EP17HTDA-2 Die Attach Epoxy
Key Features
- Not premixed and frozen
- Paste consistency
- Thermally conductive, electrically insulating
- High compressive strength
- Single-component system
- Can withstand temperatures used in electronic packaging such as wire bonding
- NASA low outgassing
The EP17HTDA-2 one-component epoxy from Master Bond is a dimensionally stable system featuring mechanical properties with both a high modulus and die shear strength which transfer heat and resist thermo-mechanical stresses effectively.
This epoxy has exceptional temperature resistance with a service temperature range of -80°F to +600°F [-62°C to +316°C] and a Tg of 185-190°C. It has a thermal conductivity of 9-10 BTU•in/ft2•hr•°F [1.30-1.44 W/(m·K)], a low coefficient of thermal expansion, and is also electrically insulative with a volume resistivity greater than 1015 ohm-cm. It withstands a variety of chemicals including acids, bases, salts, fuels, oils, water and many solvents.
As a one part system, EP17HTDA-2 does not require any mixing and is curable in the temperature range of 300-350°F for 4-5 hours. To optimize properties, a post cure of 2-3 hours at 400°F is recommended. It bonds well to a wide variety of substrates, such as metals, ceramics, plastics and composites. Upon curing, it delivers a tensile modulus exceeding 1,100,000 psi and a die shear strength of 20-23 kg-f at room temperature (2 x 2 mm [80 x 80 mil]). It also has minimal shrinkage upon curing.
While EP17HTDA-2 is well suited for electronic and related applications, it can also be used in vacuum situations as it passes NASA low outgassing testing. It is a thixotropic paste, yet is available in 10 cc and 30 cc syringes for automated dispensing, and has a shelf life of 3-6 months when stored at 40-50°F.