Dedicated Driver-Monitoring System ASIC Eliminates External Circuitry

Jan. 5, 2021

OmniVision’s OAX8000 ASIC suits entry-level DMSs with low power consumption for processing eye-gaze and eye-tracking algorithms.

David Maliniak

Related To: OMNIVISION

Driver-monitoring systems (DMSs) look to be a booming business in the next few years, thanks in part to EU requirements that all new vehicles sold in the region include a DMS camera by 2022. OmniVision Technologies is hoping to get a jump on competitors with its OAX8000, an AI-enabled, automotive ASIC optimized for entry-level, standalone driver-monitoring systems. The OAX8000 uses a stacked-die architecture to provide the industry’s only DMS processor with on-chip DDR3 SDRAM memory (1 GB).

Targeted for driver monitoring systems, OmniVision's OAX8000 processor incorporates DDR3 SDRAM memory.

The OAX8000 is also claimed to be the only dedicated DMS processor to integrate a neural processing unit (NPU) and image signal processor (ISP), which provides dedicated processing speeds up to 1.1 trillion operations per second for eye-gaze and eye-tracking algorithms. These high processing speeds with 1K MAC of convolutional neural network (CNN) acceleration, along with integrated SDRAM, enable the lowest power consumption available for DMS systems—the OAX8000 and OmniVision automotive image sensor consume just 1 W in typical conditions, combined. Further optimizing DMS systems, this integration also reduces the board area for the engine control unit (ECU).

Given that it is dedicated to DMS functionality, the OAX8000 sidesteps the need for added circuitry to perform DMS functions that consume more power, occupy more space, and do not allow for on-chip SDRAM.

The OAX8000’s on-chip NPU is supported by the popular TensorFlow, Caffe, MXNet, and ONNX tool chains. Additionally, this ASIC embeds quad Arm Cortex-A5 CPU cores with Neon technology for accelerated video encoding/decoding and on-chip video analytics algorithms, along with hardware for image processing, video encoding, and RGB/IR processing.

The device’s high-dynamic-range (HDR) processing capability allows the ASIC to accept input from RBG/IR image sensors and support high-quality output, for videos taken during the day or at night, in conditions with widely contrasting bright and dark images. The integrated video encoder accepts up to 5-Mpixel captures from OmniVision’s automotive image sensors, and outputs up to 2K resolution video at 30 frames/s.

Boot-up time for the OAX8000 is significantly faster than its nearest competitor. This rapid startup eliminates any delay between ignition and activation of the DMS camera. Furthermore, it supports secure-boot features to provide cybersecurity.

Other applications include processing occupant-detection algorithms, such as distinguishing a baby from a grocery bag, and providing alerts when objects are left behind in the vehicle. This ASIC also can be used in automotive video security systems to perform functions such as FaceID, as well as preset driver-comfort settings (e.g., seat position) that are activated when the DMS first scans the driver’s face.

Samples of the new OAX8000 ASIC are available now in a BGA196 package. It is AEC-Q100 Grade 2-certified for automotive applications.

OmniVision Technologies, www.ovt.com

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.