Filtronics' Hercules II E-band transceiver

E-Band Transceiver and Amplifier Module Boost Backhaul Capacities

July 12, 2024

Modules bring all the T/R functions of an E-band link and support spectrally efficient modulation schemes to underpin low-latency private networks.

David Maliniak

Browse our complete IMS 2024 coverage.

Filtronic (Booth 626) comes to IMS 2024 with its Hercules II system for E-band links. The turnkey package combines the company’s Morpheus II transceiver and either a Cerus 4 or 8 solid-state power amplifier (SSPA) to bring high performance and versatility to high-speed backhaul networks and/or low-latency private networks.

By integrating the Morpheus X2 module, which contains all the necessary transmit and receive functions for the RF section of an E-band link, with the Cerus power amplifier, the Hercules II offers seamless integration and a host of exceptional benefits. This combination facilitates a straightforward and efficient connection to a high data rate full duplex modem while significantly boosting the available transmit power, ensuring extended reach and enhanced coverage.

The Hercules II also supports spectrally efficient modulation techniques, optimizing bandwidth usage and ensuring higher data throughput. Key features of the Hercules II include Tx saturated powers exceeding +35 dBm, low phase noise, and support for up to 512-QAM modulation.

The Cerus32 is a high-performance, E-band SSPA designed to meet the growing demands of high-capacity wireless communication networks, such as low-Earth-orbit satellite communications. The Cerus 32 is said to be the most powerful commercially available E-band SSPA, with up to +43 dBm of transmit power. Each Cerus 32 module incorporates Filtronic’s in-house MMIC chip design and power-combining techniques, delivering maximum linear power. The high-power SSPA can be applied in a range of applications and is specifically suitable for commercial, military and satcom applications.

Additionally, the Hades X2 e-band active diplexer specifically targets applications that demand high power and efficiency. The diplexer achieves high efficiency and minimal power consumption through advanced GaAs MMIC technology and state-of-the-art thermal management, making it suitable for sustainable network deployments.

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.