0820 Mw St Micro Iis2 Iclx Inclinometer Promo 5f47ce0ad6454

Highly Accurate MEMS Inclinometer Sports Machine-Learning Core

Aug. 27, 2020

The stable, accurate, and repeatable two-axis inclinometer serves applications such as antenna positioning.

STMicroelectronics’ IIS2ICLX is a high-accuracy, low-power, 2-axis digital inclinometer for use in applications such as antenna positioning, industrial automation and structural health monitoring. It features a programmable machine-learning core and 16 independent programmable finite state machines that help edge devices save power and reduce data transfers to the cloud.

With its advanced embedded functions, the IIS2ICLX lowers system-level power consumption to extend the operation of battery-powered nodes. The sensor’s inherent characteristics simplify integration into high-performing products, while minimizing the effort and cost of calibration.

Using MEMS accelerometer technology, the IIS2ICLX inclinometer has a selectable full scale of ±0.5/±1/±2/±3g and provides outputs over an I²C or SPI digital interface. Embedded compensation maintains stability over temperature to within 0.075 mg/°C, ensuring high accuracy and repeatability even when ambient temperatures undergo extreme fluctuations. Its ultra-low noise density of 15μg/√Hz enables high-resolution tilt sensing as well as sensing of low-level, low-frequency vibration, as required in structural-health monitoring.

The combination of high stability and repeatability, high accuracy, and high resolution make the IIS2ICLX particularly suited to industrial applications such as antenna pointing and monitoring, platform leveling, forklift and construction machines, leveling instruments, equipment installation and monitoring, and installation and sun tracking for solar panels, as well as Industry 4.0 applications such as robots and autonomous guided vehicles (AGVs).

In structural-health monitoring, accurately measuring inclination and vibration with the IIS2ICLX can help assess the integrity of structures such as tall towers and infrastructure like bridges or tunnels. Affordable, battery-powered MEMS tilt sensors containing the IIS2ICLX enable many more structures to be monitored for safety than has been economically viable using earlier, more expensive technologies.

Whereas many high-accuracy inclinometers are single-axis devices, the 2-axis IIS2ICLX accelerometer can sense the tilt with respect to a horizontal plane along two axes (pitch and roll) or, by combining the two axes, can measure the tilt with high and repeatable accuracy and resolution with respect to a single direction of the horizontal plane over a range of ±180°. The digital output simplifies system design and reduces bill-of-materials (BOM) cost by saving external digital-to-analog conversion or filtering.

To ease the adoption of the IIS2ICLX and accelerate application development, ST also provides specific software libraries to support sensor calibration and real-time computation of tilt angle. Such software libraries are part of the X-CUBE-MEMS1 expansion software package for STM32Cube

The IIS2ICLX is housed in a high-performance, ceramic-cavity LGA package measuring 5 mm x 5 mm x 1.7 mm, with an operating temperature range of -40°C to +105°C. It is available now in sample quantities. The devices are in volume production now, with a web price of $15.00.

STMicroelectronics, www.st.com

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.