Future Directions in RF PCB Design and Design Tools
Join us for this Microwaves & RF-hosted webinar with key Editorial Advisory Board members.
November 22, 2024 11:00 AM ET / 10:00 AM CT / 8:00 AM PT / 4:00 PM GMT
Duration: 1 hour Already registered?Click here to log in.
Summary
Since around the 1940s, printed circuit boards have served as a foundational element in nearly all electronic systems. When it comes to today’s high-frequency RF and microwave circuits, the PCB can be a determining factor in the system’s performance. Signal reflection losses due to impedance mismatches and losses resulting from dielectrics and dissipation factors have long been of concern to designers, but at RF or microwave frequencies, these can make or break your project.
In this webinar, we’ll discuss some of today’s critical issues and trends in RF PCB design.
What are some of the current trends in PCB system architectures, such as multi board 3D systems or high-density interconnect (HDI) PCBs?
How about advaced materials like polyimide, ceramic, and metal-core PCBs?
How are artificial intelligence and/or machine learning being integrated into PCB design tools?
How will multi-physics analysis be applied to PCB design work?
What changes are coming to RF to PCB workflows and the impact on RF system simulation in PCB design?
This webinar, the fifth in our 2024 series of events with members of Microwaves & RF's Editorial Advisory Board or their representatives, will examine the future of RF PCB design and design tools.
Speakers
Host: David Maliniak | Executive Editor, Microwaves & RF Endeavor Business Media
David Vye | Product Management Director Cadence Design Systems David Vye, Product Management Director at Cadence, is responsible for the company’s product messaging and positioning in the RF/microwave market. David has held several technical and marketing positions throughout the RF/microwave industry. He holds a BSEE from the University of Massachusetts at Dartmouth, with a concentration in microwave engineering.
