Paul Whytock

Editor-in-Chief
Microwaves & RF

Paul Whytock is European Editor for Microwaves & RF and European Editor-in-Chief for Electronic Design. He reports on the latest news and technology developments in Europe for his US readers while providing his European engineering audience with global news coverage from the electronics sector. Trained originally as a design engineer with Ford Motor Co., Whytock holds an HNC in mechanical, electrical, and production engineering.

Articles by Paul Whytock
Test Solutions Reach 500 GHz
PARIS, FRANCE: At this year's European Microwave Week, Rohde & Schwarz presented solutions that range to 500 GHz. The highlights included the R&S FSVR real-time spectrum analyzer covering to 30 GHz and the R&S ZVA high-end network analyzer with ...
LTE Developments Accelerate As Joint Ventures Bear Fruit
Geneva, Switzerland and Stockholm, Sweden: Ericsson and ST-Ericsson, the joint venture company formed between STMicroelectronics and Ericsson, recently demonstrated what they claim to be the first complete end-to-end timedivision Long-Term ...
LTE, HSPA+, 3G, And GSM Platform
In other LTE design and development news, ST-Ericsson and Sagem Wireless are developing a multimode platform for the launch of commercial multimode LTE/HSPA+ products. Sagem Wireless, which is based in Cergy-Pontoise, France, is working with ...
Single-Chip Bluetooth Platform
The Bluetooth platform developed by CSR is a single-mode, single-chip low-energy platform. Low-energy Bluetooth systems are important to the wireless communications sector for applications like remote controls, health and well-being devices, ...
Energy Efficiency Drives Automotive And Bluetooth Developments 6
NEUBIBERG, GERMANY AND CAMBRIDGE, ENGLANDTwo new developments are promising to help the automotive, industrial, and communications sectors develop more energy-efficient systems. German chipmaker Infineon Technologies, for example, unveiled its ...
Rohde & Schwarz Enters Global Scope Arena
Munich, Germany: Test and measurement specialist Rohde & Schwarz (R&S) chose the picturesque setting of Tegernsee in Southern Bavaria to announce its entry into the global oscilloscope market. Speaking at the event, R&S President and CEO Michael Vohrer ...
One Billion Devices
AMONG THESE ACHIEVEMENTS, NXP also is celebrating a production milestone with its ICODE chip. Recently, the company shipped its one-billionth component. In an effort to maintain this device's success, NXP has launched the ICODE SLIx ...
NXP Commits To SiGe Roadmap As Sales Of ICODE Chips Hit A Billion
Eindhoven, Netherlands: By the end of this year, NXP Semiconductors plans to release 50 different products based on its new silicon germanium: carbide (SiGe:C) process technology. The process, dubbed QUBiC4, is designed to meet the needs of ...
UHF Solutions
IN ADDITION TO ITS0.25-m QUBiC4Xi SiGe:C devices, NXP Semiconductors has developed an ultra-high-frequency (UHF) radio-frequencyidentification (RFID) solution for the fashion, retail, and electronics markets. The UCODE G2iL and G2iL+ achieve good ...
MEMS Expands Its CMOS Presence
According to Germany-based MEMS foundry X-Fab, one of its prime assets is the in-house co-existence of MEMS and CMOS mixed-signal processes. Because MEMS devices are manufactured using techniques that are similar to those employed for ICs, ...
Breakthrough Builds MEMS On Standard CMOS Wafer
A Spanish company, Baolab Systems, has pioneered a new technology that is expected to cut the cost of microelectromechanical systems (MEMS) while strongly impacting mobile communication design. Key to this breakthrough is the company's ability to ...
Power Efficiency Takes Center Stage At Mobile World Congress
In addition to drawing enormous crowds, the Mobile World Congress (MWC) in Barcelona, Spain hosted an array of 1300 companies. Those companies were hoping to attract the attention of original-equipment-manufacturing (OEM) designers, mobile-phone ...
SoC Makes Breakthrough
For Global Foundriesin conjunction with ARMSpain's mobile-communications techfest offered an opportunity to unveil a system-on-a-chip (SoC) technology for powering next-generation wireless products and applications. The chip manufacturing ...
Femtocell Reference Platform Is Under Development
GUILDFORD, ENGLANDA flexible, high-performance reference platform for femtocell designs is being developed through a collaboration between Lime Microsystems and Percello. The platform combines Percello's PRC6xxx baseband IC with Lime's multiband, ...
Chip Helps Manage M2M Mobile Communications
GENEVA, SWITZERLANDSmart-card integrated-circuit (IC) maker STMicroelectronics has developed a low-power processor chip dedicated to managing SIM data for machine-to-machine (M2M) cellular communications. Recent research is suggesting that ...

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