Innovative Chips Help Thermal Flow

B-Series Therma-Bridges are thermal-management devices that use a thermally conductive aluminum-nitride chip with metalized terminals to conduct heat from one location on a printed-circuit board (PCB) to another. Therma-Bridges are available in a variety of sizes and thicknesses to support different PCB designs and thermal requirements. Standard units are supplied in case sizes from 0505 (0.050 x 0.050 in.) through 3725 (0.375 x 0.250 in.). Three different thicknesses are available, depending on the case size, of 0.020, 0.035 and 0.050 in. maximum.

International Manufacturing Services (www.ims-resistors.com)

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GaN Roundtable: The State of GaN Reliability Today

Wednesday, April 3rd, 2013, 2:00 pm ET. Gallium nitride (GaN) has come a long way over the past few years in terms of affordability, industry acceptance and, in particular, reliability. In this webcast roundtable, a panel of expert speakers will assess the current state of GaN reliability, along with offering predictions for its future.

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Agilent Technologies Complex Modulation Generation with Low Cost Arbitrary Waveform Generators - Agilent's Trueform Architecture for Wireless Applications
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