==============================                              Microwaves & RF UPDATE                              PlanetEE - www.planetee.com                              MWRF - www.mwrf.com                              January 20, 2005                              ==============================                              Greetings and welcome to your personal copy of PlanetEE's Microwaves and                               RF UPDATE e-newsletter. Please see below for address-change or                               subscribe/unsubscribe instructions.                              Today's Table of Contents:                              1. Designing for Changing Markets                               2. Agilent Names Sullivan New President/CEO                               3. Markets for MM-Wave MMICs Poised For Growth                               4. IC Holds Trio of MIMO Transceivers                               5. FOCUS Enhancements Readies for UWB Video                               6. Integrated Passive Technology Shrinks WLANs                               7. SiGe Reports Fivefold Revenue Growth                               8. FCI Grants High-Speed Connector License to Gore                               9. AWR Teams With Rohde & Schwarz                               10. Happenings - Conferences                               ************************ ADVERTISEMENT ****************************                                  First 3 dB Hybrid Combiner to cover 380 to 2500 MHz                              Microlab/FXR provides common antenna solution to combining UHF wireless                               signals with those in the 850/1900 Cellular Bands.                               The new truly wideband Hybrid Combiner, CA-14N, covers 380 to 2,500 MHz.                               Now installers of base stations in the UHF bands of TETRA, Homeland                               Security, and the new CDMA-450 applications can combine signal paths to                               the antenna with cellular wireless signals.                               Download full details at: http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BOLQ0AN                               *******************************************************************                              ***************                              1.  Viewpoint                               ***************                              Designing for Changing Markets                              Design engineers are accustomed to dealing with variables. Over time,                               however, the number of variables in the design process has increased.                               Designers once concerned only with a set of circuit-element values must                               now take into consideration such factors as the bill of materials (BOM)                               and the time to market. In some markets, such as when selling to                               automotive-electronics customers, even the cost becomes a variable. Most                               automotive customers require a cost scheme that decreases over time                               (based on their own projected product lifetimes for a given model                               vehicle). This forces suppliers of integrated circuits (ICs), for                               example, to arrive at an initial price for their products that is                               considerably higher than their projected price 10 years hence. Assuming                               that the IC supplier maintains suitably profitable margins for their                               products, part of a design plan for automotive ICs must include                               strategies for improving product yield and manufacturing efficiency                               while reducing final product cost throughout the lifetime of the design.                              Not every high-frequency company will be able to gear itself to sales in                               markets like automotive electronics. Some firms, such as IC houses, can                               take advantage of process improvements and higher levels of integration                               to create more function (per dollar) per chip.                              But for traditional microwave component suppliers, where package and                               connector costs often exceed the cost of the circuitry, the road to                               consumer markets may not be as smooth. Still, even traditional military                               customers now evaluate cost more than ever, placing greater pressures on                               high-frequency designers to create cost-effective solutions. In any                               case, designing for such markets requires a long-term strategy that                               includes process improvements, BOM reductions, and increased use of                               automation on manufacturing and testing.                               JACK BROWNE                              Publisher/Editor                              Please share your thoughts by contacting me at: mailto:jbrowne@penton.com                              For the full editorial, visit Microwaves & RF ---> http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BBmv0AK                              *************                              2. News                              *************                              Agilent Names Sullivan New President/CEO                              The board of directors of Agilent Technologies has elected William P.                               (Bill) Sullivan as the company's next president and chief executive                               officer(CEO), effective March 1, 2005. Sullivan, 55, currently Agilent's                               executive vice president and chief operating officer (COO), succeeds the                               retiring Ned Barnholt as CEO. Barnholt notes that "I leave Agilent with                               a great sense of pride in terms of what we have accomplished. We are                               financially sound, we have a leaner, more flexible organization, and we                               have extended our market leadership through continued innovation. It's                               the right time for me to step down, and Bill Sullivan is clearly the                               right person to lead the company forward." James G. Cullen, 62, who has                               served on Agilent's board of directors since 2000, will assume the                               position of non-executive chairman upon Barnholt's retirement in March.                               At that time, Sullivan will join the board. Barnholt will stay on as                               chairman emeritus as long as needed to ensure a smooth transition.                              Agilent Technologies ---> http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BOLR0AO                              *********                              3. News                              *********                              Markets for MM-Wave MMICs Poised For Growth                              Millimeter-wave monolithic microwave integrated circuits                               (MMICs)represent a strong growth opportunity according to research firm                               Engalco. In the firm's latest report, "Millimeter-wave MMIC's - the                               Worldwide industry & Market Opportunities to 2012," mm-wave MMICs are                               expected to see expanding use in business segments such as Ka-band                               satellite systems and automotive radars. The report notes that the total                               available market (TAM) for mm-wave MMICs will grow steadily from $384.9                               million in 2004 to more than $1.7 billion by the end of 2012, which is                               an average annual compound growth rate of just over 20 percent. Although                               defense electronics is still the mainstay of mm-wave MMICs, commercial                               opportunities will be increasingly important in satellite                               communications, automotive electronics, and secure access links for                               enterprise applications. The study provides detailed market and data on                               applications in the industrial, scientific, and medical (ISM) area,                               wireless infrastructure, and 40G/80G fiber-optic segment. The report                               includes in-depth studies on the types of fabrication plants, typical                               product offerings, types of modules into which these MMICs are                               implemented, and the increasingly significant roles of fabless players.                               Engalco ---> http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BOLS0AP                              *********                              4. News                              *********                              IC Holds Trio of MIMO Transceivers                              Athena Semiconductors, Inc. and Samsung Electronics' Digital Media R&D                               Center have developed a single integrated-circuit (IC) solution for the                               emerging wireless Multiple Input Multiple Output (MIMO) standard (IEEE                               802.11n). The IC, called TRINI, contains three RF CMOS OptimRF                               transceivers based on Athena's patent-pending, modified direct                               conversion architecture. The device is designed to provide a data rate                               that is far higher than existing IEEE 802.11a/g WLAN-standards-based                               equipment, increasing from 54 Mb/s to more than 200 Mb/s. First                               demonstrated at the Consumer Electronics Show (CES) in Las Vegas, NV                               (January 6-9, 2005), the chip was used to transmit and receive two                               simultaneous High Definition Television (HDTV) video streams and a                               single Standard Definition Television video stream with link throughputs                               in excess of 50 Mb/s.                               Athena Semiconductors ---> http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BOLT0AQ                              Samsung Electronics ---> http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BOLU0AR                                                             **********                              5. News                              **********                              FOCUS Enhancements Readies for UWB Video                              Video specialist FOCUS Enhancements recently demonstrated the                               effectiveness of wireless high-definition TV (HDTV) transmissions using                               low-power ultrawideband (UWB) technology. By means of video                               transmissions through a wall in its semiconductor facility in Hillsboro,                               OR, FOCUS showed that the technology is suitable for video distribution                               throughout the home of the future. The company's UWB technology is                               designed to be interoperable with standards set by the Multiband OFDM                               Alliance (MBOA), but with extended range and data rates. The firm                               expects to sample UWB chipsets towards the end of the first half of 2005                               and modules containing UWB chipsets later in the year.  Performance                               expectations are anticipated to range from 880 Mb/s at 8 m to 37 Mb/s at                               around 40 m. According to Tom Hamilton, executive vice president and                               general manager of FOCUS Enhancements' semiconductor group, "We have                               essentially doubled the IEEE's UWB targets of 110 Mb/s over 10 m. Other                               solutions fall short in delivering sustained high-resolution video, are                               hampered by short range, and/or are subject to interference from                               microwave ovens and cordless telephones.  We have managed to overcome                               these obstacles - even sending an HD stream through a wall - and come up                               with something that can actually work in the real world."                              FOCUS Enhancements ---> http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BOLV0AS                              ************************ ADVERTISEMENT ****************************                                  Maury Microwave Automated Load Pull Measurement For PA Designers                              In January 2005, Maury Microwave Corporation is releasing the latest                               software for our Automated Tuner System, MT993 Version 4.0.  Key                               features of Version 4.0 include an improved GUI, significant functional                               enhancements, complete migration and support for ATN systems, and a                               comprehensive DLL kit.  With this release, Maury continues to provide                               leading-edge solutions for device characterization measurements.  For                               additional details, please contact our Sales Department at                               mailto:sales@maurymw.com or phone (909) 987-4715.                              Find out what's new at Maury by visiting our website:                              http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BOLW0AT                              *******************************************************************                              *********                              6. News                              *********                              Integrated Passive Technology Shrinks WLANs                              SyChip has developed Integrated Passive Device (IPD) technology to                               miniaturize integrated modules for mobile and WLAN markets. The                               technology allows a complete IEEE 802.11g module to be fabricated in an                               area of 90 square millimeters and only 0.9 millimeters high. The                               technology enables the integration of approximately 50 passive                               components, such as capacitors, filters, and inductors, directly into                               the IPD substrate, providing enhanced performance along with a large                               reduction in discrete components. According to Moses Asom, SyChip                               co-founder and senior vice president of marketing and business                               development, "SyChip's IPD technology, with its world class size,                               electrical performance and plug-and-play capability, is perfectly                               positioned to meet the market challenges and help manufacturers reduce                               design cycles by six months."                              SyChip ---> http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BOLX0AU                              *********                              7. News                              *********                              SiGe Reports Fivefold Revenue Growth                              SiGe Semiconductor today reported sales revenue of $20.1 million US                               ($24.6 million Canadian) for 2004, a fivefold increase compared to the                               previous year. The company's success was fueled by the growing demand                               for its Bluetooth, GPS, and WLAN integrated circuits (ICs). The company                               ended the year more than 30 million units sent to customers around the                               world, with many of these devices shipped to China. According to SiGe                               president and CEO, Jim Derbyshire, "we expanded our product line,                               captured significant market share in key wireless arenas, and expanded                               our operations as a global company with a greater emphasis                              on the Asia-Pacific region."                              SiGe Semiconductor ---> http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth04us0A4                              *********                              8. News                              *********                              FCI Grants High-Speed Connector License to Gore                              FCI announced that is has granted a license to W. L. Gore & Associates,                               Inc. for the use of its AirMax VS (registered) connector technology.                               Matched with Gore's capabilities in high-frequency, high-speed cables,                               the combination is expected to yield high-performance interconnect                               solutions for a wide range of applications, including for                               telecommunications systems and IP switches. According to Rob Poort,                               Global Communications Market Manager at FCI, "working with Gore will                               drive the development of high performance digital cable connectors that                               can support very high data rate transmissions." Gore Global Data Comm                               Market Segment Leader, David Gioconda, concurs: "We are pleased to bring                               together FCI's expertise in high speed connector design with Gore's high                               data rate cable technology to offer a data link that can provide an                               aggregate bandwidth of 1.0 Terabits per second using only 50 linear                               millimeters of backplane space."                              FCI ---> http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BOLY0AV                              WL Gore ---> http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BOLZ0AW                              *********                              9. News                              *********                              AWR Teams With Rohde & Schwarz                              Software supplier Applied Wave Research (AWR) has announced that it is                               teaming with test-equipment maker Rohde & Schwarz to provide test                               solutions backed by AWR's design software. These solutions provide                               bidirectional transfer of data between instruments and EDA software, and                               the capability to use measured data in place of models when simulating                               complex systems. In addition, Rohde & Schwarz will strengthen the AWR                               sales channel by providing AWR's Microwave Office and Visual System                               Simulator (VSS) design solutions throughout Europe.                              Applied Wave Research ---> http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BOLa0Ad                              Rohde & Schwarz ---> http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BOLb0Ae                              *******************************                              10.  Happenings - Conferences                              *******************************                              ARMMS RF & Microwave Society Conference                              April 18-19, 2005                              Milton Hill House Hotel, Milton Hill, Oxfordshire, UK                              http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BOLc0Af                              IEEE Compound Semiconductor IC Symposium (formerly the GaAs IC                               Symposium)                              October 30 - November 2, 2005                              Palm Springs, CA                              http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BOLd0Ag                              Read past issues of Microwaves and RF (MWRF) UPDATE e-Newsletter:                               http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth0BBmv0AK                              MICROWAVES AND RF (MWRF) UPDATE e-NEWSLETTER CONTACTS                              ====================================================                              Publisher and Executive Editor: Jack Browne                              mailto:jbrowne@penton.com                              Advertising/Sponsorship Opportunities:                              Jim Theriault at 1-925-736-5051 or                              send email to mailto:jtheriault@penton.com                              ====================================================                              To subscribe send a blank email to:                              mailto:Microwaves_and_RF_UPDATE_Sub@lists.planetee.com                              To unsubscribe send a blank email to:                              mailto:Microwaves_and_RF_UPDATE_Unsub@lists.planetee.com                              You are subscribed as jcurley@penton.com                              Penton's e-Newsletter homepage:                              http://lists.planetee.com/cgi-bin3/DM/y/eA0JtlqC0Gth01Zp0AW                              ====================================                              Copyright 2005 Penton Media Inc. 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