mmWave technologies comprising high-speed RF data links.

Advanced Tech Supports High-Rate RF Data Links

July 22, 2024

See a brief demo video of some of Samtec's relevant technologies used to build up RF data links.

Browse our complete IMS 2024 coverage.

RF data links are important system building blocks and various technologies must come together to comprise effective and efficient versions of these links. In a recent demonstration, Samtec showed how several of its technologies can be put to use for RF data-link use cases.

In the demonstration, 256-QAM signals from an Agilent waveform generator were routed through Samtec’s Nitrowave cable assemblies. These 40-in. cables are phase-matched to 1 ps. A second element of the demo was an Analog Over Array board leveraging the company’s SEARAY lineup of high-density, open-field arrays.

The demo used mmWave broadband radio traffic modulated by a variable attenuator to a 73-GHz carrier frequency at a data rate of 24 Gb/s. The radio circuitry was built on a glass substrate implementing Samtec’s Glass Core Technology. Also incorporated in the demo was an E-band flexible waveguide comprising a 6-in. cable.

Browse our complete IMS 2024 coverage.

About the Author

David Maliniak | Executive Editor, Microwaves & RF

I am Executive Editor of Microwaves & RF, an all-digital publication that broadly covers all aspects of wireless communications. More particularly, we're keeping a close eye on technologies in the consumer-oriented 5G, 6G, IoT, M2M, and V2X markets, in which much of the wireless market's growth will occur in this decade and beyond. I work with a great team of editors to provide engineers, developers, and technical managers with interesting and useful articles and videos on a regular basis. Check out our free newsletters to see the latest content.

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About me:

In his long career in the B2B electronics-industry media, David Maliniak has held editorial roles as both generalist and specialist. As Components Editor and, later, as Editor in Chief of EE Product News, David gained breadth of experience in covering the industry at large. In serving as EDA/Test and Measurement Technology Editor at Electronic Design, he developed deep insight into those complex areas of technology. Most recently, David worked in technical marketing communications at Teledyne LeCroy, leaving to rejoin the EOEM B2B publishing world in January 2020. David earned a B.A. in journalism at New York University.