As a member of the Sensors Open System Architecture (SOSA) Consortium, TE Connectivity has helped create an open systems standard that will speed the development of defense electronic systems from different vendors will achieving full interoperability of embedded sensors within those systems. As part of its contribution to SOSA Technical Standard 1.0, TE Connectivity has developed flexible interconnect solutions based on the OpenVPX architecture (see the figure).
These compact connectors support circuit-board-to-board data rates of more than 32 Gb/s while still meeting VITA 46 requirements for shock and vibration. Their modular architecture invites the construction of many different multiple-circuit-board configurations that meet or exceed defense system requirements for small size, weight, power, and cost (SWaP-C) as part of design efforts to realize miniaturization without sacrificing functionality.
Franck Kolczak, senior manager of business development for TE Connectivity’s Aerospace, Defense & Marine Division, said: “The evolution of these standards is being driven by the demand for increased bandwidth and faster data speeds. To meet this rising demand, TE has worked closely with leading systems developers like The SOSA Consortium to develop interconnect technologies that not only endure in harsh aerospace, military, and battlespace environments but also provide the space, weight, and power savings that are still required.”